5962-8866206UA datasheet, PDF - EEWORLD Datasheet

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5962-8866206UA: DescriptionStandard SRAM, 32KX8, 25ns, CMOS, CQCC28; Categorystorage storage; File Size320KB，8 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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5962-8866206UA Overview

Standard SRAM, 32KX8, 25ns, CMOS, CQCC28

5962-8866206UA Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
package instruction	QCCN, LCC28,.35X.55
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	25 ns
I/O type	COMMON
JESD-30 code	R-CQCC-N28
JESD-609 code	e0
length	13.97 mm
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC28,.35X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	3.048 mm
Maximum standby current	0.02 A
Minimum standby current	4.5 V
Maximum slew rate	0.16 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8.89 mm
Base Number Matches	1

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	5962-8866206UA	5962-8866205UA	5962-8866205YA	5962-8866206YA	5962-8866207YA	5962-8866207UA
Description	Standard SRAM, 32KX8, 25ns, CMOS, CQCC28	Standard SRAM, 32KX8, 35ns, CMOS, CQCC28	Standard SRAM, 32KX8, 35ns, CMOS, CQCC32	Standard SRAM, 32KX8, 25ns, CMOS, CQCC32	Standard SRAM, 32KX8, 20ns, CMOS, CQCC32	Standard SRAM, 32KX8, 20ns, CMOS, CQCC28
package instruction	QCCN, LCC28,.35X.55	QCCN,	QCCN,	QCCN,	QCCN,	QCCN, LCC28,.35X.55
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	25 ns	35 ns	35 ns	25 ns	20 ns	20 ns
JESD-30 code	R-CQCC-N28	R-CQCC-N28	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N28
length	13.97 mm	13.97 mm	13.97 mm	13.97 mm	13.97 mm	13.97 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	28	28	32	32	32	28
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	QCCN	QCCN	QCCN	QCCN	QCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.048 mm	3.048 mm	3.048 mm	3.048 mm	2.03 mm	1.905 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	8.89 mm	8.89 mm	11.43 mm	11.43 mm	11.43 mm	8.89 mm
Base Number Matches	1	1	1	1	1	1
Maker	LOGIC Devices	-	-	LOGIC Devices	LOGIC Devices	LOGIC Devices
JESD-609 code	e0	e0	e0	e0	e0	-
Peak Reflow Temperature (Celsius)	225	-	NOT SPECIFIED	NOT SPECIFIED	-	225
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	-
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED

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