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5962-9559504HMX

Description
SRAM Module, 128KX32, 70ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Categorystorage    storage   
File Size452KB,10 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9559504HMX Overview

SRAM Module, 128KX32, 70ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

5962-9559504HMX Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeQFP
package instructionQFP,
Contacts68
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time70 ns
Other featuresUSER CONFIGURABLE AS 128K X 32 OR 256K X 16
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length22.4 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width22.4 mm
Base Number Matches1
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187
FEATURES
n
Access Times of 70, 85, 100, 120ns
n
MIL-STD-883 Compliant Devices Available
n
Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400).
• 68 lead, 40mm Low Profile CQFP, 3.56mm
(0.140")(Package 502).
• 68 lead, Hermetic CQFP, 22.4mm (0.880 inch)
square. Designed to fit JEDEC 68 lead 0.990"
CQFJ footprint.
– G2 (Package 500), 5.08mm (0.200 inch) high
– G2U (Package 510), 4.57mm (0.140 inch) high
n
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
n
Commercial, Industrial and Military Temperature
Ranges
n
5 Volt Power Supply
n
Low Power CMOS
n
TTL Compatible Inputs and Outputs
n
Built in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation
n
Weight
WS128K32-XG2X - 8 grams typical
WS128K32-XG2UX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
n
All devices are upgradeable to 512Kx32
4
SRAM MODULES
FIG. 1
PIN CONFIGURATION FOR WS128K32N-XH1X
TOP VIEW
PIN DESCRIPTION
I/O
0-31
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
May 2001 Rev. 2
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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