DP8473DB datasheet, PDF - EEWORLD Datasheet

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DP8473DB: DescriptionIC,DISK CONTROLLER,CMOS,SO,48PIN; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，28 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DP8473DB Overview

IC,DISK CONTROLLER,CMOS,SO,48PIN

DP8473DB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	SOP, SO48(UNSPEC)
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G48
JESD-609 code	e0
Number of terminals	48
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SO48(UNSPEC)
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal location	DUAL
Base Number Matches	1

DP8473DB Related Products

	DP8473DB	DP8473V	DP8473N
Description	IC,DISK CONTROLLER,CMOS,SO,48PIN	1Mbps, FLOPPY DISK DRIVE CONTROLLER, PQCC52, PLASTIC, CC-52	1Mbps, FLOPPY DISK DRIVE CONTROLLER, PDIP48, PLASTIC, DIP-48
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	SOP, SO48(UNSPEC)	QCCJ, LDCC52,.8SQ	DIP, DIP48,.6
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-PDSO-G48	S-PQCC-J52	R-PDIP-T48
JESD-609 code	e0	e0	e0
Number of terminals	48	52	48
Maximum operating temperature	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	QCCJ	DIP
Encapsulate equivalent code	SO48(UNSPEC)	LDCC52,.8SQ	DIP48,.6
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	J BEND	THROUGH-HOLE
Terminal location	DUAL	QUAD	DUAL
Maximum data transfer rate	-	0.125 MBps	0.125 MBps
External data bus width	-	8	8
Host interface standard	-	PC-AT; PC-XT; PS/2	PC-AT; PC-XT; PS/2
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED
Maximum slew rate	-	20 mA	20 mA
Maximum supply voltage	-	5.5 V	5.5 V
Minimum supply voltage	-	4.5 V	4.5 V
Terminal pitch	-	1.27 mm	2.54 mm
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	-	SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE	SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE

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