5962-8680506QC datasheet, PDF - EEWORLD Datasheet

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5962-8680506QC: DescriptionUVPROM, 64KX16, 120ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44; Categorystorage storage; File Size159KB，5 Pages; ManufacturerWaferscale Integration Inc.

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5962-8680506QC Overview

UVPROM, 64KX16, 120ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44

5962-8680506QC Parametric

Parameter Name	Attribute value
Maker	Waferscale Integration Inc.
package instruction	WINDOWED, CERAMIC, LLCC-44
Reach Compliance Code	unknown
Maximum access time	120 ns
JESD-30 code	S-CQCC-N44
JESD-609 code	e4
length	16.535 mm
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	16
Number of functions	1
Number of terminals	44
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX16
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.3 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	16.535 mm
Base Number Matches	1

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5962-8680506QC Related Products

	5962-8680506QC	5962-8680506XA	5962-8680505XA	5962-8680504XC	5962-8680504QA	5962-8680505QC
Description	UVPROM, 64KX16, 120ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44	UVPROM, 64KX16, 120ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 150ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44	UVPROM, 64KX16, 170ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 150ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44
package instruction	WINDOWED, CERAMIC, LLCC-44	0.600 INCH, WINDOWED, CERDIP-40	0.600 INCH, WINDOWED, CERDIP-40	WINDOWED, CERAMIC, LLCC-44	0.600 INCH, WINDOWED, CERDIP-40	WINDOWED, CERAMIC, LLCC-44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	120 ns	120 ns	150 ns	170 ns	170 ns	150 ns
JESD-30 code	S-CQCC-N44	R-GDIP-T40	R-GDIP-T40	S-CQCC-N44	R-GDIP-T40	S-CQCC-N44
JESD-609 code	e4	e0	e0	e4	e0	e4
length	16.535 mm	52.455 mm	52.455 mm	16.535 mm	52.455 mm	16.535 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	44	40	40	44	40	44
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCN	WDIP	WDIP	WQCCN	WDIP	WQCCN
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE
Package form	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.3 mm	5.72 mm	5.72 mm	3.3 mm	5.72 mm	3.3 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	GOLD	TIN LEAD	TIN LEAD	GOLD	TIN LEAD	GOLD
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	QUAD	DUAL	DUAL	QUAD	DUAL	QUAD
width	16.535 mm	15.24 mm	15.24 mm	16.535 mm	15.24 mm	16.535 mm
Maker	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	-	Waferscale Integration Inc.
Base Number Matches	1	1	1	1	1	-

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