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MCP23S17

Description
16 I/O, PIA-GENERAL PURPOSE, PQCC28
Categorysemiconductor    The embedded processor and controller   
File Size640KB,48 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Download Datasheet Parametric Compare View All

MCP23S17 Overview

16 I/O, PIA-GENERAL PURPOSE, PQCC28

MCP23S17 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals28
Maximum operating temperature125 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage5.5 V
Minimum supply/operating voltage4.5 V
Rated supply voltage5 V
Number of input and output buses16
Processing package description6 × 6 MM, plastic, QFN-28
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
packaging shapeSQUARE
Package SizeChip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
surface mountYes
Terminal formNO
Terminal spacing0.6500 mm
terminal coatingMATTE Tin
Terminal locationFour
Packaging MaterialsPlastic/Epoxy
Temperature levelAUTOMOTIVE
Microprocessor typeUniversal PIA
Number of ports2
MCP23017/MCP23S17
16-Bit I/O Expander with Serial Interface
Features
• 16-bit remote bidirectional I/O port
- I/O pins default to input
• High-speed I
2
C™ interface (MCP23017)
- 100 kHz
- 400 kHz
- 1.7 MHz
• High-speed SPI interface (MCP23S17)
- 10 MHz (max.)
• Three hardware address pins to allow up to eight
devices on the bus
• Configurable interrupt output pins
- Configurable as active-high, active-low or
open-drain
• INTA and INTB can be configured to operate
independently or together
• Configurable interrupt source
- Interrupt-on-change from configured register
defaults or pin changes
• Polarity Inversion register to configure the polarity
of the input port data
• External Reset input
• Low standby current: 1 µA (max.)
• Operating voltage:
- 1.8V to 5.5V @ -40°C to +85°C
- 2.7V to 5.5V @ -40°C to +85°C
- 4.5V to 5.5V @ -40°C to +125°C
Package Types
PDIP,
SOIC,
SSOP
GPB0
GPB1
GPB2
GPB3
GPB4
GPB5
GPB6
GPB7
V
DD
V
SS
NC
SCL
SDA
NC
•1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
GPA7
GPA6
GPA5
GPA4
GPA3
GPA2
GPA1
GPA0
INTA
INTB
RESET
A2
A1
A0
MCP23017
QFN
GPB4
GPB5
GPB6
GPB7
V
DD
V
SS
NC
1
2
3
4
5
6
7
28 27 26 25 24 23 22
21
20
19
MCP23017
18
17
16
15
8 9 10 11 121314
SCL
SDA
NC
A0
A1
A2
RESET
GPA4
GPA3
GPA2
GPA1
GPA0
INTA
INTB
PDIP,
SOIC,
SSOP
GPB3
GPB2
GPB1
GPB0
GPA7
GPA6
GPA5
•1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
MCP23017
Packages
28-pin PDIP (300 mil)
28-pin SOIC (300 mil)
28-pin SSOP
28-pin QFN
MCP23S17
GPB0
GPB1
GPB2
GPB3
GPB4
GPB5
GPB6
GPB7
V
DD
V
SS
CS
SCK
SI
SO
GPA7
GPA6
GPA5
GPA4
GPA3
GPA2
GPA1
GPA0
INTA
INTB
RESET
A2
A1
A0
QFN
GPB4
GPB5
GPB6
GPB7
V
DD
V
SS
CS
1
2
3
4
5
6
7
28 27 26 25 24 23 22
21
20
19
MCP23S17
18
17
16
15
8 9 10 11 121314
SCK
SI
SO
A0
A1
A2
RESET
GPB3
GPB2
GPB1
GPB0
GPA7
GPA6
GPA5
MCP23S17
GPA4
GPA3
GPA2
GPA1
GPA0
INTA
INTB
©
2007 Microchip Technology Inc.
DS21952B-page 1

MCP23S17 Related Products

MCP23S17 MCP23017 MCP23S17T-E/SP MCP23017T-E/SP MCP23017T-E/SS MCP23017-E/SP
Description 16 I/O, PIA-GENERAL PURPOSE, PQCC28 16 I/O, PIA-GENERAL PURPOSE, PQCC28 16 I/O, PIA-GENERAL PURPOSE, PQCC28 16 I/O, PIA-GENERAL PURPOSE, PQCC28 16 I/O, PIA-GENERAL PURPOSE, PDSO28 16 I/O, PIA-GENERAL PURPOSE, PQCC28
Number of terminals 28 28 28 28 28 28
Maximum operating temperature 125 Cel 125 Cel 125 Cel 125 Cel 125 °C 125 °C
Minimum operating temperature -40 Cel -40 Cel -40 Cel -40 Cel -40 °C -40 °C
surface mount Yes Yes Yes Yes YES NO
Terminal form NO NO NO NO GULL WING THROUGH-HOLE
Terminal location Four Four Four Four DUAL DUAL
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Number of ports 2 2 2 2 2 2
Number of functions 1 1 1 1 - -
Maximum supply/operating voltage 5.5 V 5.5 V 5.5 V 5.5 V - -
Minimum supply/operating voltage 4.5 V 4.5 V 4.5 V 4.5 V - -
Rated supply voltage 5 V 5 V 5 V 5 V - -
Number of input and output buses 16 16 16 16 - -
Processing package description 6 × 6 MM, plastic, QFN-28 6 × 6 MM, plastic, QFN-28 6 × 6 MM, plastic, QFN-28 6 × 6 MM, plastic, QFN-28 - -
Lead-free Yes Yes Yes Yes - -
EU RoHS regulations Yes Yes Yes Yes - -
China RoHS regulations Yes Yes Yes Yes - -
state ACTIVE ACTIVE ACTIVE ACTIVE - -
packaging shape SQUARE SQUARE SQUARE SQUARE - -
Package Size Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - -
Terminal spacing 0.6500 mm 0.6500 mm 0.6500 mm 0.6500 mm - -
terminal coating MATTE Tin MATTE Tin MATTE Tin MATTE Tin - -
Packaging Materials Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy - -
Microprocessor type Universal PIA Universal PIA Universal PIA Universal PIA - -
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