74CBTLVD3245DS datasheet, PDF - EEWORLD Datasheet

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74CBTLVD3245DS: DescriptionSPECIALTY ANALOG CIRCUIT, PDSO20, 3.9 MM WIDTH, 0.635 MM PITCH, PLASTIC, MO-137, SSOP-20; CategoryThe signal circuit; File Size409KB，19 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74CBTLVD3245DS Overview

SPECIALTY ANALOG CIRCUIT, PDSO20, 3.9 MM WIDTH, 0.635 MM PITCH, PLASTIC, MO-137, SSOP-20

74CBTLVD3245DS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SSOP
package instruction	3.9 MM WIDTH, 0.635 MM PITCH, PLASTIC, MO-137, SSOP-20
Contacts	20
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	ANALOG CIRCUIT
JESD-30 code	R-PDSO-G20
length	8.7 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
Maximum seat height	1.73 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
surface mount	YES
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3.9 mm
Base Number Matches	1

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74CBTLVD3245

8-bit level-shifting bus switch with output enable

Rev. 3 — 16 December 2011

Product data sheet

1. General description

The 74CBTLVD3245 is an 8-pole, single-throw bus switch. The device features a single

output enable input (OE) that controls eight switch channels. The switches are disabled

when OE is HIGH. Schmitt trigger action at control inputs makes the circuit tolerant of

slower input rise and fall times. This device is fully specified for partial power-down

applications using I

OFF

. The I

OFF

circuitry disables the output, preventing the damaging

backflow current through the device when it is powered down.

2. Features and benefits



Supply voltage range from 3.0 V to 3.6 V



High noise immunity



Complies with JEDEC standard:



JESD8-B/JESD36 (3.0 V to 3.6 V)



ESD protection:



HBM JESD22-A114F exceeds 2000 V



CDM AEC-Q100-011 revision B exceeds 1000 V





switch connection between two ports



Rail to rail switching on data I/O ports



CMOS low power consumption



Latch-up performance exceeds 250 mA per JESD78B Class I level A



OFF

circuitry provides partial Power-down mode operation



Multiple package options



Specified from

40 C

to +85

C

and

40 C

to +125

C

3. Ordering information

Table 1.

Ordering information

Package

Temperature

range

74CBTLVD3245DS

Name

Description

plastic shrink small outline package; 20 leads; body

width 3.9 mm; lead pitch 0.635 mm

plastic thin shrink small outline package; 20 leads;

body width 4.4 mm

Version

SOT724-1

SOT360-1

SOT764-1

Type number

40 C

to +125

C

SSOP20

[1]

74CBTLVD3245PW

40 C

to +125

C

TSSOP20

74CBTLVD3245BQ

40 C

to +125

C

DHVQFN20 plastic dual-in-line compatible thermal enhanced very

thin quad flat package; no leads; 20 terminals; body

2.5



4.5



0.85 mm

74CBTLVD3245DS Related Products

	74CBTLVD3245DS	74CBTLVD3245BQ	74CBTLVD3245PW
Description	SPECIALTY ANALOG CIRCUIT, PDSO20, 3.9 MM WIDTH, 0.635 MM PITCH, PLASTIC, MO-137, SSOP-20	SPECIALTY ANALOG CIRCUIT, PQCC20, 2.5 X 4.5 MM, PLASTIC, MO-241, DHVQFN-20	SPECIALTY ANALOG CIRCUIT, PDSO20, 4.4 MM WIDTH, PLASTIC, MO-153, TSSOP-20
Is it Rohs certified?	conform to	conform to	conform to
Maker	NXP	NXP	NXP
Parts packaging code	SSOP	QFN	TSSOP
package instruction	3.9 MM WIDTH, 0.635 MM PITCH, PLASTIC, MO-137, SSOP-20	2.5 X 4.5 MM, PLASTIC, MO-241, DHVQFN-20	4.4 MM WIDTH, PLASTIC, MO-153, TSSOP-20
Contacts	20	20	20
Reach Compliance Code	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT
JESD-30 code	R-PDSO-G20	R-PQCC-N20	R-PDSO-G20
length	8.7 mm	4.5 mm	6.5 mm
Humidity sensitivity level	1	1	1
Number of functions	1	1	1
Number of terminals	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	HQCCN	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260
Maximum seat height	1.73 mm	1.075 mm	1.1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V
surface mount	YES	YES	YES
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	GULL WING	NO LEAD	GULL WING
Terminal pitch	0.635 mm	0.5 mm	0.65 mm
Terminal location	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	30	30	30
width	3.9 mm	2.5 mm	4.4 mm
Base Number Matches	1	1	1

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