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LH28F008SCHR-L85

Description
Flash Memory 8M (1MB 】 8)
Categorystorage    storage   
File Size528KB,55 Pages
ManufacturerSHARP
Websitehttp://sharp-world.com/products/device/
Download Datasheet Parametric Compare View All

LH28F008SCHR-L85 Overview

Flash Memory 8M (1MB 】 8)

LH28F008SCHR-L85 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSHARP
package instruction10 X 20 MM, PLASTIC, REVERSE, TSOP1-40
Reach Compliance Codeunknow
Maximum access time150 ns
Other featuresACCESS TIME 120 NS AT VCC 3.3+/-0.3V
JESD-30 codeR-PDSO-G40
JESD-609 codee0
length18.4 mm
memory density8388608 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals40
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize1MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1-R
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width10 mm
P
RODUCT
S
PECIFICATIONS
®
Integrated Circuits Group
LH28F008SCT-L85
Flash Memory
8M (1MB × 8)
(Model No.: LHF08CH1)
Spec No.: EL104027C
Issue Date: April 24, 2000

LH28F008SCHR-L85 Related Products

LH28F008SCHR-L85 LH28F008SCT-L12 LH28F008SCN-L12 LH28F008SCHT-L12 LH28F008SCHR-L12 LH28F008SCB-L12 LH28F008SCHN-L12 LH28F008SCHB-L12
Description Flash Memory 8M (1MB 】 8) Flash Memory 8M (1MB 】 8) Flash Memory 8M (1MB 】 8) Flash Memory 8M (1MB 】 8) Flash Memory 8M (1MB 】 8) Flash Memory 8M (1MB 】 8) Flash Memory 8M (1MB 】 8) Flash Memory 8M (1MB 】 8)
Maker SHARP SHARP SHARP SHARP SHARP SHARP SHARP SHARP
package instruction 10 X 20 MM, PLASTIC, REVERSE, TSOP1-40 10 X 20 MM, PLASTIC, TSOP1-40 0.600 INCH, PLASTIC, SOP-44 10 X 20 MM, PLASTIC, TSOP1-40 10 X 20 MM, PLASTIC, REVERSE, TSOP1-40 6 X 8 MM, PLASTIC, CSP, FBGA-48 0.600 INCH, PLASTIC, SOP-44 6 X 8 MM, PLASTIC, CSP, FBGA-48
Reach Compliance Code unknow unknow unknow unknow unknow unknow unknow unknow
Maximum access time 150 ns 170 ns 170 ns 170 ns 170 ns 170 ns 170 ns 170 ns
Other features ACCESS TIME 120 NS AT VCC 3.3+/-0.3V ACCESS TIME 150 NS AT VCC 3.3+/-0.3V ACCESS TIME 150 NS AT VCC 3.3+/-0.3V ACCESS TIME 150 NS AT VCC 3.3+/-0.3V ACCESS TIME 150 NS AT VCC 3.3+/-0.3V ACCESS TIME 150 NS AT VCC 3.3+/-0.3V ACCESS TIME 150 NS AT VCC 3.3+/-0.3V ACCESS TIME 150 NS AT VCC 3.3+/-0.3V
JESD-30 code R-PDSO-G40 R-PDSO-G40 R-PDSO-G44 R-PDSO-G40 R-PDSO-G40 R-PBGA-B48 R-PDSO-G44 R-PBGA-B48
length 18.4 mm 18.4 mm 28.2 mm 18.4 mm 18.4 mm 8 mm 28.2 mm 8 mm
memory density 8388608 bi 8388608 bi 8388608 bi 8388608 bi 8388608 bi 8388608 bi 8388608 bi 8388608 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 40 40 44 40 40 48 44 48
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C 85 °C
Minimum operating temperature -25 °C - - -25 °C -25 °C - -25 °C -25 °C
organize 1MX8 1MX8 1MX8 1MX8 1MX8 1MX8 1MX8 1MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1-R TSOP1 SOP TSOP1 TSOP1-R TFBGA SOP TFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Programming voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 3.15 mm 1.2 mm 1.2 mm 1.2 mm 3.15 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER COMMERCIAL COMMERCIAL OTHER OTHER COMMERCIAL OTHER OTHER
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING BALL GULL WING BALL
Terminal pitch 0.5 mm 0.5 mm 1.27 mm 0.5 mm 0.5 mm 0.8 mm 1.27 mm 0.8 mm
Terminal location DUAL DUAL DUAL DUAL DUAL BOTTOM DUAL BOTTOM
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 10 mm 10 mm 13.2 mm 10 mm 10 mm 6 mm 13.2 mm 6 mm
JESD-609 code e0 e6 e6 e6 e6 - e6 -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED -
Terminal surface TIN LEAD TIN BISMUTH TIN BISMUTH TIN BISMUTH TIN BISMUTH - TIN BISMUTH -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED -
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