W9812G2GH datasheet, PDF - EEWORLD Datasheet

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W9812G2GH: Descriptiona high-speed synchronous dynamic random access memory (SDRAM), organized as 1,048,576 words 】 4 banks 】 32 bits; File Size1MB，42 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W9812G2GH Overview

a high-speed synchronous dynamic random access memory (SDRAM), organized as 1,048,576 words 】 4 banks 】 32 bits

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W9812G2GH

Table of Contents-

GENERAL DESCRIPTION .............................................................................................................. 3

FEATURES...................................................................................................................................... 3

AVAILABLE PART NUMBER .......................................................................................................... 3

PIN CONFIGURATION.................................................................................................................... 4

PIN DESCRIPTION ......................................................................................................................... 5

BLOCK DIAGRAM........................................................................................................................... 6

FUNCTIONAL DESCRIPTION ........................................................................................................ 7

7.1

7.2

7.3

7.4

7.5

7.6

7.7

7.8

7.9

7.10

7.11

7.12

7.13

7.14

7.15

7.16

7.17

7.18

7.19

7.20

Power Up and Initialization.................................................................................................... 7

Programming Mode Register ................................................................................................ 7

Bank Activate Command ....................................................................................................... 7

Read and Write Access Modes ............................................................................................. 7

Burst Read Command ........................................................................................................... 8

Burst Write Command ........................................................................................................... 8

Read Interrupted by a Read .................................................................................................. 8

Read Interrupted by a Write .................................................................................................. 8

Write Interrupted by a Write .................................................................................................. 8

Write Interrupted by a Read .................................................................................................. 8

Burst Stop Command ............................................................................................................ 9

Addressing Sequence of Sequential Mode ........................................................................... 9

Addressing Sequence of Interleave Mode ............................................................................ 9

Auto-precharge Command .................................................................................................. 10

Precharge Command .......................................................................................................... 10

Self Refresh Command ....................................................................................................... 10

Power Down Mode .............................................................................................................. 11

No Operation Command...................................................................................................... 11

Deselect Command ............................................................................................................. 11

Clock Suspend Mode .......................................................................................................... 11

OPERATION MODE...................................................................................................................... 12

ELECTRICAL CHARACTERISTICS ............................................................................................. 13

9.1

9.2

9.3

9.4

Absolute Maximum Ratings................................................................................................. 13

Recommended DC Operating Conditions ........................................................................... 13

Capacitance......................................................................................................................... 13

DC Characteristics............................................................................................................... 14

-1-

Publication Release Date: Aug. 13,2007

Revision A07

W9812G2GH

9.5

10.1

10.2

10.3

10.4

11.1

11.2

11.3

11.4

11.5

11.6

11.7

11.8

11.9

AC Characteristics and Operating Condition....................................................................... 15

Command Input Timing ....................................................................................................... 17

Read Timing ........................................................................................................................ 18

Control Timing of Input/Output Data.................................................................................... 19

Mode Register Set Cycle..................................................................................................... 20

Interleaved Bank Read (Burst Length = 4, CAS Latency = 3)............................................. 21

Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge).................. 22

Interleaved Bank Read (Burst Length = 8, CAS Latency = 3)............................................. 23

Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge).................. 24

Interleaved Bank Write (Burst Length = 8) .......................................................................... 25

Interleaved Bank Write (Burst Length = 8, Auto-precharge) ............................................... 26

Page Mode Read (Burst Length = 4, CAS Latency = 3) ..................................................... 27

Page Mode Read / Write (Burst Length = 8, CAS Latency = 3).......................................... 28

Auto-precharge Read (Burst Length = 4, CAS Latency = 3)............................................... 29

TIMING WAVEFORMS.................................................................................................................. 17

Operating Timing Example ............................................................................................................ 21

11.10 Auto-precharge Write (Burst Length = 4) ............................................................................ 30

11.11 Auto Refresh Cycle.............................................................................................................. 31

11.12 Self Refresh Cycle............................................................................................................... 32

11.13 Burst Read and Single Write (Burst Length = 4, CAS Latency = 3).................................... 33

11.14 Power Down Mode .............................................................................................................. 34

11.15 Auto-precharge Timing (Read Cycle).................................................................................. 35

11.16 Auto-precharge Timing (Write Cycle) .................................................................................. 36

11.17 Timing Chart of Read to Write Cycle................................................................................... 37

11.18 Timing Chart of Write to Read Cycle................................................................................... 37

11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command) .................................................. 38

11.20 Timing Chart of Burst Stop Cycle (Precharge Command) .................................................. 38

11.21 CKE/DQM Input Timing (Write Cycle) ................................................................................. 39

11.22 CKE/DQM Input Timing (Read Cycle)................................................................................. 40

Package Specification ................................................................................................................... 41

12.1

86L TSOP (II)-400 mil.......................................................................................................... 41

REVISION HISTORY..................................................................................................................... 42

-2-

Publication Release Date: Aug. 13,2007

Revision A07

W9812G2GH Related Products

	W9812G2GH	W9812G2GH-6I	W9812G2GH-6C	W9812G2GH-6	W9812G2GH-75
Description	a high-speed synchronous dynamic random access memory (SDRAM), organized as 1,048,576 words 】 4 banks 】 32 bits	a high-speed synchronous dynamic random access memory (SDRAM), organized as 1,048,576 words 】 4 banks 】 32 bits	a high-speed synchronous dynamic random access memory (SDRAM), organized as 1,048,576 words 】 4 banks 】 32 bits	a high-speed synchronous dynamic random access memory (SDRAM), organized as 1,048,576 words 】 4 banks 】 32 bits	a high-speed synchronous dynamic random access memory (SDRAM), organized as 1,048,576 words 】 4 banks 】 32 bits
Is it Rohs certified?	-	conform to	conform to	conform to	conform to
Maker	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	-	TSOP2	TSOP2	TSOP2	TSOP2
package instruction	-	TSOP2, TSSOP86,.46,20	TSOP2, TSSOP86,.46,20	TSOP2, TSSOP86,.46,20	TSOP2, TSSOP86,.46,20
Contacts	-	86	86	86	86
Reach Compliance Code	-	compli	compli	compli	compli
ECCN code	-	EAR99	EAR99	EAR99	EAR99
access mode	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	-	5 ns	5 ns	5 ns	5.4 ns
Other features	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	-	166 MHz	166 MHz	166 MHz	133 MHz
I/O type	-	COMMON	COMMON	COMMON	COMMON
interleaved burst length	-	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8
JESD-30 code	-	R-PDSO-G86	R-PDSO-G86	R-PDSO-G86	R-PDSO-G86
length	-	22.22 mm	22.22 mm	22.22 mm	22.22 mm
memory density	-	134217728 bi	134217728 bi	134217728 bi	134217728 bi
Memory IC Type	-	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
memory width	-	32	32	32	32
Number of functions	-	1	1	1	1
Number of ports	-	1	1	1	1
Number of terminals	-	86	86	86	86
word count	-	4194304 words	4194304 words	4194304 words	4194304 words
character code	-	4000000	4000000	4000000	4000000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	85 °C	70 °C	70 °C	70 °C
organize	-	4MX32	4MX32	4MX32	4MX32
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TSOP2	TSOP2	TSOP2	TSOP2
Encapsulate equivalent code	-	TSSOP86,.46,20	TSSOP86,.46,20	TSSOP86,.46,20	TSSOP86,.46,20
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	-	4096	4096	4096	4096
Maximum seat height	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm
self refresh	-	YES	YES	YES	YES
Continuous burst length	-	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP
Maximum standby current	-	0.002 A	0.002 A	0.002 A	0.002 A
Maximum slew rate	-	0.23 mA	0.23 mA	0.23 mA	0.21 mA
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	-	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS
Temperature level	-	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	-	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	10.16 mm	10.16 mm	10.16 mm	10.16 mm

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