74ACT11821J datasheet, PDF - EEWORLD Datasheet

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74ACT11821J: DescriptionIC,FLIP-FLOP,10-BIT,D TYPE,ACT-CMOS,DIP,28PIN,CERAMIC; Categorylogic; File Size320KB，5 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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74ACT11821J Overview

IC,FLIP-FLOP,10-BIT,D TYPE,ACT-CMOS,DIP,28PIN,CERAMIC

74ACT11821J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP28,.6
Reach Compliance Code	not_compliant
JESD-30 code	R-XDIP-T28
Logic integrated circuit type	D FLIP-FLOP
Number of functions	10
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3/5 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Trigger type	POSITIVE EDGE
Base Number Matches	1

74ACT11821J Related Products

	74ACT11821J	54ACT11821J	SNJ54ACT11821J	74ACT11821N
Description	IC,FLIP-FLOP,10-BIT,D TYPE,ACT-CMOS,DIP,28PIN,CERAMIC	IC,FLIP-FLOP,10-BIT,D TYPE,ACT-CMOS,DIP,28PIN,CERAMIC	IC,FLIP-FLOP,10-BIT,D TYPE,ACT-CMOS,DIP,28PIN,CERAMIC	IC,FLIP-FLOP,10-BIT,D TYPE,ACT-CMOS,DIP,28PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-XDIP-T28	R-XDIP-T28	R-XDIP-T28	R-PDIP-T28
Logic integrated circuit type	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP
Number of functions	10	10	10	10
Number of terminals	28	28	28	28
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Trigger type	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE
Base Number Matches	1	1	1	1

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