|
5962-88637013A |
PLDC20G10-25HC |
PLDC20G10B-20WI |
| Description |
OT PLD, 40ns, CMOS, CQCC28, CERAMIC, LCC-28 |
UV PLD, 25ns, PAL-Type, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28 |
UV PLD, 20ns, PAL-Type, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 |
| Maker |
Cypress Semiconductor |
Cypress Semiconductor |
Cypress Semiconductor |
| Parts packaging code |
QLCC |
QLCC |
DIP |
| package instruction |
QCCN, |
WINDOWED, CERAMIC, LCC-28 |
0.300 INCH, WINDOWED, CERDIP-24 |
| Contacts |
28 |
28 |
24 |
| Reach Compliance Code |
unknown |
compliant |
compliant |
| Other features |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
| maximum clock frequency |
16.6 MHz |
33.3 MHz |
41.6 MHz |
| JESD-30 code |
S-CQCC-N28 |
S-CQCC-J28 |
R-GDIP-T24 |
| JESD-609 code |
e0 |
e0 |
e0 |
| length |
11.43 mm |
11.43 mm |
31.877 mm |
| Dedicated input times |
10 |
10 |
10 |
| Number of I/O lines |
10 |
10 |
10 |
| Number of terminals |
28 |
28 |
24 |
| Maximum operating temperature |
125 °C |
75 °C |
85 °C |
| Minimum operating temperature |
-55 °C |
- |
-40 °C |
| organize |
10 DEDICATED INPUTS, 10 I/O |
10 DEDICATED INPUTS, 10 I/O |
10 DEDICATED INPUTS, 10 I/O |
| Output function |
MACROCELL |
MACROCELL |
MACROCELL |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, GLASS-SEALED |
| encapsulated code |
QCCN |
WQCCJ |
WDIP |
| Package shape |
SQUARE |
SQUARE |
RECTANGULAR |
| Package form |
CHIP CARRIER |
CHIP CARRIER, WINDOW |
IN-LINE, WINDOW |
| Programmable logic type |
OT PLD |
UV PLD |
UV PLD |
| propagation delay |
40 ns |
25 ns |
20 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.9812 mm |
4.57 mm |
5.08 mm |
| Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
NO |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
COMMERCIAL EXTENDED |
INDUSTRIAL |
| Terminal surface |
TIN LEAD |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
NO LEAD |
J BEND |
THROUGH-HOLE |
| Terminal pitch |
1.27 mm |
1.27 mm |
2.54 mm |
| Terminal location |
QUAD |
QUAD |
DUAL |
| width |
11.43 mm |
11.43 mm |
7.62 mm |
| Is it Rohs certified? |
- |
incompatible |
incompatible |
| Architecture |
- |
PAL-TYPE |
PAL-TYPE |
| Number of entries |
- |
22 |
22 |
| Output times |
- |
10 |
10 |
| Number of product terms |
- |
90 |
90 |
| Encapsulate equivalent code |
- |
LDCC28,.5SQ |
DIP24,.3 |
| Peak Reflow Temperature (Celsius) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
- |
5 V |
5 V |
| Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |