5962-8685918LA datasheet, PDF - EEWORLD Datasheet

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5962-8685918LA: DescriptionStandard SRAM, 16KX4, 35ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24; Categorystorage; File Size209KB，8 Pages; ManufacturerCypress Semiconductor

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5962-8685918LA Overview

Standard SRAM, 16KX4, 35ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24

5962-8685918LA Parametric

Parameter Name	Attribute value
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	35 ns
Other features	AUTOMATIC POWER-DOWN
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	31.877 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	24
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX4
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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5962-8685918LA Related Products

	5962-8685918LA	5962-8989204LA	5962-8969202YA	5962-8989202LA	5962-8685924YA	5962-8969204YA
Description	Standard SRAM, 16KX4, 35ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24	Standard SRAM, 16KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24	Standard SRAM, 16KX4, 25ns, CMOS, CDIP22, 0.300 INCH, CERDIP-22	Standard SRAM, 16KX4, 25ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24	Standard SRAM, 16KX4, 35ns, CMOS, CDIP22, 0.300 INCH, CERDIP-22	Standard SRAM, 16KX4, 20ns, CMOS, CDIP22, 0.300 INCH, CERDIP-22
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,
Contacts	24	24	22	24	22	22
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	35 ns	20 ns	25 ns	25 ns	35 ns	20 ns
Other features	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
JESD-30 code	R-GDIP-T24	R-GDIP-T24	R-GDIP-T22	R-GDIP-T24	R-GDIP-T22	R-GDIP-T22
JESD-609 code	e0	e0	e0	e0	e0	e0
length	31.877 mm	31.877 mm	27.559 mm	31.877 mm	27.559 mm	27.559 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	24	24	22	24	22	22
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	NO	YES	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Base Number Matches	1	1	1	1	1	1
Maker	Cypress Semiconductor	-	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor

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