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5962-9559505HYX

Description
SRAM Module, 128KX32, 55ns, CMOS, CQFP68, 40 X 40 MM, CERAMIC, QFP-68
Categorystorage   
File Size495KB,9 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

5962-9559505HYX Overview

SRAM Module, 128KX32, 55ns, CMOS, CQFP68, 40 X 40 MM, CERAMIC, QFP-68

5962-9559505HYX Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction40 X 40 MM, CERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time55 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
JESD-30 codeS-CQFP-F68
length39.6 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFF
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height3.56 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width39.6 mm
Base Number Matches1
White Electronic Designs
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
FEATURES
Access Times of 15, 17, 20, 25, 35, 45, 55ns
MIL-STD-883 Compliant Devices Available
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400)
• 68 lead, 40mm CQFP (G4T)
1
, 3.56mm (0.140")
(Package 502)
• 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),
(Package 510)
• 68 lead, 22.4mm (0.880") square, CQFP (G2L),
5.08mm (0.200") high, (Package 528)
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
Commercial, Industrial and Military Temperature
Ranges
5 Volt Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight:
WS128K32-XG2UX - 8 grams typical
WS128K32-XG2LX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX
1
- 20 grams typical
Devices are upgradeable to 512Kx32
This product is subject to change without notice.
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
11
May 2006
Rev. 17
Pin Description
34
45
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
#
GND
I/O
19
44
55
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
OE#
A0-16
WE#1 CS#1
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
22
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
33
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
56
I/O
0-31
A
0-16
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE#2 CS#2
WE#3 CS#3
WE#4 CS#4
128K x 8
128K x 8
128K x 8
128K x 8
8
8
8
8
I/O 0-7
I/O 8-15
I/O 16-23
I/O 24-31
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