5962-9313902MCA datasheet, PDF

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5962-9313902MCA: DescriptionBuffer/Inverter Based MOSFET Driver, CMOS, CDIP14; CategoryDrivers and interfaces; File Size340KB，9 Pages; ManufacturerMicrel ( Microchip ); Websitehttps://www.microchip.com

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5962-9313902MCA Overview

Buffer/Inverter Based MOSFET Driver, CMOS, CDIP14

5962-9313902MCA Parametric

Parameter Name	Attribute value
Maker	Micrel ( Microchip )
package instruction	DIP,
Reach Compliance Code	unknown
ECCN code	EAR99
high side driver	YES
Interface integrated circuit type	BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 code	R-GDIP-T14
JESD-609 code	e0
Number of functions	1
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum supply voltage	32 V
Minimum supply voltage	4.75 V
Nominal supply voltage	15 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Disconnect time	10 µs
connection time	200 µs
Base Number Matches	1

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Description	Buffer/Inverter Based MOSFET Driver, CMOS, CDIP14	Buffer/Inverter Based MOSFET Driver, CMOS, CDIP14, CERAMIC, DIP-14	Buffer/Inverter Based MOSFET Driver, CMOS, CDIP14, CERAMIC, DIP-14	Buffer/Inverter Based MOSFET Driver, CMOS, CDIP14, CERAMIC, DIP-14
package instruction	DIP,	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
high side driver	YES	YES	YES	YES
Interface integrated circuit type	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 code	R-GDIP-T14	R-GDIP-T14	R-GDIP-T14	R-GDIP-T14
JESD-609 code	e0	e0	e0	e0
Number of functions	1	2	2	2
Number of terminals	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage	32 V	32 V	32 V	32 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	15 V	15 V	15 V	15 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Terminal surface	TIN LEAD	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL
Disconnect time	10 µs	10 µs	10 µs	10 µs
connection time	200 µs	200 µs	200 µs	200 µs
Base Number Matches	1	1	1	1
Is it Rohs certified?	-	incompatible	incompatible	incompatible
Parts packaging code	-	DIP	DIP	DIP
Contacts	-	14	14	14
Input properties	-	STANDARD	STANDARD	STANDARD
length	-	19.304 mm	19.304 mm	19.304 mm
Output characteristics	-	TOTEM-POLE	TOTEM-POLE	TOTEM-POLE
Output polarity	-	TRUE	TRUE	TRUE
Encapsulate equivalent code	-	DIP14,.3	DIP14,.3	DIP14,.3
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-	15 V	15 V	15 V
Maximum seat height	-	5.08 mm	5.08 mm	5.08 mm
Maximum slew rate	-	40 mA	40 mA	40 mA
Terminal pitch	-	2.54 mm	2.54 mm	2.54 mm
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	7.62 mm	7.62 mm	7.62 mm

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