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5962-8764804XA

Description
UVPROM, 64KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
Categorystorage   
File Size451KB,17 Pages
ManufacturerWaferscale Integration Inc.
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5962-8764804XA Overview

UVPROM, 64KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28

5962-8764804XA Parametric

Parameter NameAttribute value
MakerWaferscale Integration Inc.
package instructionWINDOWED, CERAMIC, DIP-28
Reach Compliance Codeunknown
Maximum access time120 ns
JESD-30 codeR-GDIP-T28
JESD-609 codee0
length37.1475 mm
memory density524288 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals28
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize64KX8
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeWDIP
Package shapeRECTANGULAR
Package formIN-LINE, WINDOW
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.588 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
Base Number Matches1

5962-8764804XA Related Products

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Description UVPROM, 64KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 UVPROM, 64KX8, 150ns, CMOS, CDIP28, CERAMIC, DIP-28 UVPROM, 64KX8, 150ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 UVPROM, 64KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 UVPROM, 64KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 UVPROM, 64KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 UVPROM, 64KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Fixed Resistor, Metal Film, 0.2W, 69800ohm, 150V, 0.1% +/-Tol, 50ppm/Cel, 1209,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown compliant
Number of terminals 28 28 32 28 28 32 28 32 2
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package form IN-LINE, WINDOW IN-LINE CHIP CARRIER, WINDOW IN-LINE IN-LINE, WINDOW CHIP CARRIER, WINDOW IN-LINE CHIP CARRIER, WINDOW SMT
surface mount NO NO YES NO NO YES NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS THIN FILM
package instruction WINDOWED, CERAMIC, DIP-28 CERAMIC, DIP-28 WINDOWED, CERAMIC, LCC-32 CERAMIC, DIP-28 0.600 INCH, WINDOWED, CERDIP-28 WINDOWED, CERAMIC, LCC-32 CERAMIC, DIP-28 WINDOWED, CERAMIC, LCC-32 -
Maximum access time 120 ns 150 ns 150 ns 200 ns 120 ns 250 ns 250 ns 200 ns -
JESD-30 code R-GDIP-T28 R-GDIP-T28 R-CQCC-N32 R-GDIP-T28 R-GDIP-T28 R-CQCC-N32 R-GDIP-T28 R-CQCC-N32 -
JESD-609 code e0 - e0 - e0 e0 - e0 e3
length 37.1475 mm - 13.95 mm - 37.25 mm 13.95 mm - 13.95 mm -
memory density 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit -
Memory IC Type UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM -
memory width 8 8 8 8 8 8 8 8 -
Number of functions 1 1 1 1 1 1 1 1 -
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words -
character code 64000 64000 64000 64000 64000 64000 64000 64000 -
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
organize 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 -
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED -
encapsulated code WDIP DIP WQCCN DIP WDIP WQCCN DIP WQCCN -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 5.588 mm - 2.92 mm - 5.72 mm 2.92 mm - 2.92 mm -
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V -
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V -
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY -
Terminal surface TIN LEAD - TIN LEAD - TIN LEAD TIN LEAD - TIN LEAD Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal form THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD -
Terminal pitch 2.54 mm - 1.27 mm - 2.54 mm 1.27 mm - 1.27 mm -
Terminal location DUAL DUAL QUAD DUAL DUAL QUAD DUAL QUAD -
width 15.24 mm - 11.4 mm - 15.24 mm 11.4 mm - 11.4 mm -
Base Number Matches 1 1 1 1 1 1 1 1 -
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