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AM7200-25JC

Description
HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY
Categorystorage    storage   
File Size807KB,16 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

AM7200-25JC Overview

HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY

AM7200-25JC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeQFJ
package instructionQCCJ, LDCC32,.5X.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time25 ns
Other featuresRETRANSMIT
Maximum clock frequency (fCLK)28.5 MHz
period time35 ns
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.97 mm
memory density2304 bit
Memory IC TypeOTHER FIFO
memory width9
Number of functions1
Number of terminals32
word count256 words
character code256
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256X9
Output characteristics3-STATE
ExportableNO
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height3.556 mm
Maximum standby current0.005 A
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm
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