AN48810B datasheet, PDF - EEWORLD Datasheet

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AN48810B: DescriptionLow current consumption, high sensitivity CMOS Hall IC One-way magnetic field operation; CategoryAnalog mixed-signal IC The signal circuit; File Size101KB，6 Pages; ManufacturerPanasonic; Websitehttp://www.panasonic.co.jp/semicon/e-index.html; Environmental Compliance

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AN48810B Overview

Low current consumption, high sensitivity CMOS Hall IC One-way magnetic field operation

AN48810B Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	SOIC
package instruction	VSOF,
Contacts	5
Reach Compliance Code	unknow
Analog Integrated Circuits - Other Types	ANALOG CIRCUIT
JESD-30 code	R-PDSO-F5
length	2 mm
Number of functions	1
Number of terminals	5
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VSOF
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	0.9 mm
Maximum supply voltage (Vsup)	3.5 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal form	FLAT
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	1.65 mm
Base Number Matches	1

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Hall ICs

AN48810B

Low current consumption, high sensitivity CMOS Hall IC

One-way magnetic field operation

0.225

0.22

+0.10

-0.05

Unit: mm

0.13

■

Overview

The AN48810B is a Hall IC (a magnetic sensor) which

has 2 times or more sensitivity and a low current consump-

tion of about one three-hundredth compared with our

conventional one.

In this Hall IC, a Hall element, a offset cancel circuit,

an amplifier circuit, a sample and hold circuit, a Schmidt

circuit, and output stage FET are integrated on a single

chip housed in a small package by IC technique.

2.10

±0.10

1.65

±0.10

0.225

0.80

±0.10

0.32

±0.10

0 to 0.10

0.10

Seating plane

■

Features

•

High sensitivity (6 mT max.) due to offset cancel circuit

and a new sample and hold circuit

•

Small current by using intermittent action

•

Small package (SMD)

•

CMOS inverter output

SMINI-5DA (Lead-free package)

■

Applications

•

Flip type cellular phone, digital video camera

■

Block Diagram

CLK

N.C.

On/Off control

N.C.

Hall

element

Switch

Amplifier

Sample

and

hold

Out

GND

Note) The magnetism detection time should be longer than one intermittent action cycle (On

200

µs

and Off

51 ms).

■

Pin Descriptions

Pin No.

Symbol

Out

GND

N.C.

Output

Ground

Description

Pin No.

Symbol

N.C.

Power supply

Description

Publication date: November 2002

SPC00016AEB

0.11

+0.10

-0.05

0.65 0.65

1.30

±0.10

2.00

±0.10

AN48810B

■

Caution on Use of Hall ICs

The Hall ICs are often used to detect movement. In such cases, the position of the Hall IC may be changed by

exposition to shock or vibration over a long period of time, and it causes the detection level change. To prevent this, fix

the package with adhesives or fix it on a dedicated case.

1. A case using an adhesive

Some kinds of adhesive generate corrosive gas (such as chloric gas) during curing. This corrosive gas corrodes the

aluminum on the surface of the Hall IC, and may cause a functional defect of disconnection.

If Hall IC is to be sealed after installation, attention should be given to the adhesive or resin used for peripherals

and substrate cleaner, as well as to the adhesive used for Hall IC installation. Please confirm the above matter to those

manufacturers before using.

We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive.

2. Power supply line/Power transmission line

If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line.

In this case, set the capacitor of 0.1

µF

to 10

µF

near the Hall IC to prevent it.

If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the ignition

pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing elements, etc.).

3. On mounting of the surface mount type package (MINI-3DR)

When mounted on the printed circuit board, the Hall IC may be highly stressed by the warp that may occur from

the soldering. This may also cause a change in the operating magnetic flux density and a deterioration of its resistance

to moisture.

Wrong

Correct

4. V

and GND

Do not reverse V

and GND. If the V

and GND pins are reversely connected, this IC will be destroyed. If the

IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become the same as a forward

biased diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will

flow through the IC, ending up in its destruction. (This is common to monolithic IC.)

5. Cautions on power-on of Hall IC

When a Hall IC is turned on, the position of the magnet or looseness may change the output of a Hall IC, and a pulse

may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the supply

power is on.

6. On fixing a Hall IC to holder

When a Hall IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder

is large, the lead wire of the Hall IC will be stretched and it may give a stress to the Hall IC.

If the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package and

the lead wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture.

Sensitivity may also be changed by this stress.

7. On using flux in soldering

Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The

ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the

disconnection of the aluminum wiring on the surface of an IC chip.

8. In case of the magnetic field of a magnet is too strong

Output may be inverted when applying a magnetic flux density of 100 mT or more. Accordingly, magnetic flux

density should be used within the range of 100 mT.

9. On surface treatment of mini-mold package

Surface treatment is available in either smooth or dull finish.

10. On soldering of the surface mount type package

Surface mounting type Hall ICs are apt to change its electrical characteristics due to the stress from soldering at

mounting. Therefore, avoid the mounting by flow (dipping) and a soldering iron. Please mount it by reflow soldering

abiding by its recommended conditions.

SPC00016AEB

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