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PM150CLA060_05

Description
INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE
File Size125KB,8 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
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PM150CLA060_05 Overview

INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE

MITSUBISHI <INTELLIGENT POWER MODULES>
PM150CLA060
FLAT-BASE TYPE
INSULATED PACKAGE
PM150CLA060
FEATURE
a) Adopting new 5th generation IGBT (CSTBT) chip, which
performance is improved by 1µm fine rule process.
For example, typical V
ce
(sat)=1.5V @Tj=125°C
b) I adopt the over-temperature conservation by Tj detection of
CSTBT chip, and error output is possible from all each con-
servation upper and lower arm of IPM.
c) New small package
Reduce the package size by 10%, thickness by 22% from
S-DASH series.
• 3φ 150A, 600V Current-sense IGBT type inverter
• Monolithic gate drive & protection logic
• Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
• Acoustic noise-less 15kW/18.5kW class inverter application
• UL Recognized
Yellow Card No.E80276(N)
File No.E80271
APPLICATION
General purpose inverter, servo drives and other motor controls
PACKAGE OUTLINES
11
7
19.75
19.75
3.25
16
3-2
16
3-2
120
106
16
3-2
15.25
6-2
2-φ5.5
MOUNTING HOLES
Dimensions in mm
16
3
12
17.5
1
P
5
9
13
19
14.5
B
U
V
W
32
6-M5 NUTS
10.75
(SCREWING DEPTH)
11.75
13.5
55
2-φ2.5
17.5
N
12
32.75
23
23
23
22
+ 1
– 0.5
Terminal code
19-s0.5
7
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
VUPC
UFO
UP
VUP1
VVPC
VFO
VP
VVP1
VWPC
WFO
11.
12.
13.
14.
15.
16.
17.
18.
19.
WP
VWP1
VNC
VN1
NC
UN
VN
WN
Fo
13
31
12
May 2005

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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