IDT7006L20JGI datasheet, PDF - EEWORLD Datasheet

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IDT7006L20JGI: DescriptionDual-Port SRAM, 16KX8, 20ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, PLCC-68; Categorystorage; File Size179KB，20 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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IDT7006L20JGI Overview

Dual-Port SRAM, 16KX8, 20ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, PLCC-68

IDT7006L20JGI Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	LCC
package instruction	QCCJ,
Contacts	68
Reach Compliance Code	compliant
ECCN code	EAR99
Samacsys Description	IDT SRAM Memory, IDT7006L20JGI- 128kbit
Maximum access time	20 ns
JESD-30 code	S-PQCC-J68
JESD-609 code	e3
length	24.2062 mm
memory density	131072 bit
Memory IC Type	DUAL-PORT SRAM
memory width	8
Number of functions	1
Number of terminals	68
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16KX8
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	24.2062 mm
Base Number Matches	1

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HIGH-SPEED

16K x 8 DUAL-PORT

STATIC RAM

Features

◆

IDT7006S/L

◆

Functional Block Diagram

R/W

True Dual-Ported memory cells which allow simultaneous

reads of the same memory location

High-speed access

– Military: 20/25/35/55/70ns (max.)

– Industrial: 55ns (max.)

– Commercial: 15/17/20/25/35/55ns (max.)

Low-power operation

– IDT7006S

Active: 750mW (typ.)

Standby: 5mW (typ.)

– IDT7006L

Active: 700mW (typ.)

Standby: 1mW (typ.)

IDT7006 easily expands data bus width to 16 bits or more

using the Master/Slave select when cascading more than

one device

◆

M/S = H for

BUSY

output flag on Master,

M/S = L for

BUSY

input on Slave

Busy and Interrupt Flags

On-chip port arbitration logic

Full on-chip hardware support of semaphore signaling

between ports

Fully asynchronous operation from either port

Devices are capable of withstanding greater than 2001V

electrostatic discharge

Battery backup operation—2V data retention

TTL-compatible, single 5V (±10%) power supply

Available in 68-pin PGA, quad flatpack, PLCC, and a 64-pin

TQFP

Industrial temperature range (–40°C to +85°C) is available

for selected speeds

Green parts available, see ordering information

R/W

I/O

- I/O

I/O

Control

BUSY

13L

(1,2)

I/O

-I/O

I/O

Control

BUSY

(1,2)

Address

Decoder

MEMORY

ARRAY

Address

Decoder

13R

R/W

ARBITRATION

INTERRUPT

SEMAPHORE

LOGIC

R/W

SEM

(2)

INT

NOTES:

1. (MASTER):

BUSY

is output; (SLAVE):

BUSY

is input.

BUSY

outputs and

INT

outputs are non-tri-stated push-pull.

M/S

SEM

(2)

INT

2739 drw 01

OCTOBER 2008

DSC- 2739/16

IDT7006L20JGI Related Products

	IDT7006L20JGI	IDT7006L20PFGI	IDT7006L20PFGI8	IDT7006L15PFG8	IDT7006L15PFG
Description	Dual-Port SRAM, 16KX8, 20ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, PLCC-68	Dual-Port SRAM, 16KX8, 20ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64	Dual-Port SRAM, 16KX8, 20ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64	Dual-Port SRAM, 16KX8, 15ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64	Dual-Port SRAM, 16KX8, 15ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	LCC	QFP	QFP	QFP	QFP
package instruction	QCCJ,	LQFP, QFP64,.66SQ,32	LQFP, QFP64,.66SQ,32	LQFP, QFP64,.66SQ,32	LQFP, QFP64,.66SQ,32
Contacts	68	64	64	64	64
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	20 ns	20 ns	20 ns	15 ns	15 ns
JESD-30 code	S-PQCC-J68	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64
JESD-609 code	e3	e3	e3	e3	e3
length	24.2062 mm	14 mm	14 mm	14 mm	14 mm
memory density	131072 bit	131072 bit	131072 bit	131072 bit	131072 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	68	64	64	64	64
word count	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	70 °C	70 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-
organize	16KX8	16KX8	16KX8	16KX8	16KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	LQFP	LQFP	LQFP	LQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	MATTE TIN	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	J BEND	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	40	30	30	30
width	24.2062 mm	14 mm	14 mm	14 mm	14 mm
Base Number Matches	1	1	1	1	1
Samacsys Description	IDT SRAM Memory, IDT7006L20JGI- 128kbit	IDT SRAM Memory, IDT7006L20PFGI- 128kbit	-	-	IDT IDT7006L15PFG SRAM Memory, 128kbit, 4.5 → 5.5 V, 15ns 64-Pin TQFP
I/O type	-	COMMON	COMMON	COMMON	COMMON
Humidity sensitivity level	-	3	3	3	3
Number of ports	-	2	2	2	2
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE
Encapsulate equivalent code	-	QFP64,.66SQ,32	QFP64,.66SQ,32	QFP64,.66SQ,32	QFP64,.66SQ,32
power supply	-	5 V	5 V	5 V	5 V
Maximum standby current	-	0.004 A	0.004 A	0.0015 A	0.0015 A
Minimum standby current	-	2 V	2 V	2 V	2 V
Maximum slew rate	-	0.32 mA	0.32 mA	0.26 mA	0.26 mA

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