MB81C74-35CV datasheet, PDF - EEWORLD Datasheet

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MB81C74-35CV: DescriptionStandard SRAM, 16KX4, 35ns, CMOS, CQCC22; Categorystorage; File Size205KB，10 Pages; ManufacturerFUJITSU; Websitehttp://edevice.fujitsu.com/fmd/en/index.html

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MB81C74-35CV Overview

Standard SRAM, 16KX4, 35ns, CMOS, CQCC22

MB81C74-35CV Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	FUJITSU
Parts packaging code	LCC
package instruction	QCCN, LCC22,.3X.5
Contacts	22
Reach Compliance Code	unknown
Maximum access time	35 ns
I/O type	COMMON
JESD-30 code	R-XQCC-N22
JESD-609 code	e0
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of terminals	22
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX4
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC22,.3X.5
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.01 A
Minimum standby current	4.5 V
Maximum slew rate	0.1 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

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MB81C74-35CV Related Products

	MB81C74-35CV	MB81C74-35P	MB81C74-25P	MB81C74-30P	MB81C74-30CV
Description	Standard SRAM, 16KX4, 35ns, CMOS, CQCC22	Standard SRAM, 16KX4, 35ns, CMOS, PDIP22	Standard SRAM, 16KX4, 25ns, CMOS, PDIP22	Standard SRAM, 16KX4, 30ns, CMOS, PDIP22	Standard SRAM, 16KX4, 30ns, CMOS, CQCC22
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	FUJITSU	FUJITSU	FUJITSU	FUJITSU	FUJITSU
Parts packaging code	LCC	DIP	DIP	DIP	LCC
package instruction	QCCN, LCC22,.3X.5	DIP, DIP22,.3	DIP, DIP22,.3	DIP, DIP22,.3	QCCN, LCC22,.3X.5
Contacts	22	22	22	22	22
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow
Maximum access time	35 ns	35 ns	25 ns	30 ns	30 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XQCC-N22	R-PDIP-T22	R-PDIP-T22	R-PDIP-T22	R-XQCC-N22
JESD-609 code	e0	e0	e0	e0	e0
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4
Number of terminals	22	22	22	22	22
word count	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16KX4	16KX4	16KX4	16KX4	16KX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	QCCN	DIP	DIP	DIP	QCCN
Encapsulate equivalent code	LCC22,.3X.5	DIP22,.3	DIP22,.3	DIP22,.3	LCC22,.3X.5
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.1 mA	0.1 mA	0.1 mA	0.1 mA	0.1 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	QUAD

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