Standard SRAM, 16KX4, 25ns, CMOS, PDIP22
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | FUJITSU |
| Parts packaging code | DIP |
| package instruction | DIP, DIP22,.3 |
| Contacts | 22 |
| Reach Compliance Code | unknown |
| Maximum access time | 25 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDIP-T22 |
| JESD-609 code | e0 |
| memory density | 65536 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of terminals | 22 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 16KX4 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP22,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.01 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.1 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| MB81C74-25P | MB81C74-35CV | MB81C74-35P | MB81C74-30P | MB81C74-30CV | |
|---|---|---|---|---|---|
| Description | Standard SRAM, 16KX4, 25ns, CMOS, PDIP22 | Standard SRAM, 16KX4, 35ns, CMOS, CQCC22 | Standard SRAM, 16KX4, 35ns, CMOS, PDIP22 | Standard SRAM, 16KX4, 30ns, CMOS, PDIP22 | Standard SRAM, 16KX4, 30ns, CMOS, CQCC22 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | FUJITSU | FUJITSU | FUJITSU | FUJITSU | FUJITSU |
| Parts packaging code | DIP | LCC | DIP | DIP | LCC |
| package instruction | DIP, DIP22,.3 | QCCN, LCC22,.3X.5 | DIP, DIP22,.3 | DIP, DIP22,.3 | QCCN, LCC22,.3X.5 |
| Contacts | 22 | 22 | 22 | 22 | 22 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| Maximum access time | 25 ns | 35 ns | 35 ns | 30 ns | 30 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDIP-T22 | R-XQCC-N22 | R-PDIP-T22 | R-PDIP-T22 | R-XQCC-N22 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 22 | 22 | 22 | 22 | 22 |
| word count | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| character code | 16000 | 16000 | 16000 | 16000 | 16000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | QCCN | DIP | DIP | QCCN |
| Encapsulate equivalent code | DIP22,.3 | LCC22,.3X.5 | DIP22,.3 | DIP22,.3 | LCC22,.3X.5 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | QUAD |
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