UVPROM, 2KX8, 15ns, CMOS, CQCC28, CERAMIC, LCC-28
| Parameter Name | Attribute value |
| Maker | Cypress Semiconductor |
| Parts packaging code | QLCC |
| package instruction | QCCN, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 15 ns |
| JESD-30 code | S-CQCC-N28 |
| JESD-609 code | e0 |
| length | 11.43 mm |
| memory density | 16384 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 2.8956 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 11.43 mm |
| Base Number Matches | 1 |
| 5962-89815013A | 5962-89815023A | 5962-8981502LA | 5962-8981501LA | 5962-88735043A | 5962-8873503LA | 5962-88735033A | |
|---|---|---|---|---|---|---|---|
| Description | UVPROM, 2KX8, 15ns, CMOS, CQCC28, CERAMIC, LCC-28 | UVPROM, 2KX8, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28 | UVPROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24 | UVPROM, 2KX8, 15ns, CMOS, CDIP24, CERAMIC, DIP-24 | OTP ROM, 2KX8, 12ns, CMOS, CQCC28, CERAMIC, QCC-28 | OTP ROM, 2KX8, 15ns, CMOS, CDIP24, CERAMIC, DIP-24 | OTP ROM, 2KX8, 15ns, CMOS, CQCC28, CERAMIC, QCC-28 |
| Parts packaging code | QLCC | QLCC | DIP | DIP | QLCC | DIP | QLCC |
| package instruction | QCCN, | WQCCN, | DIP, | DIP, | QCCN, | DIP, | CERAMIC, QCC-28 |
| Contacts | 28 | 28 | 24 | 24 | 28 | 24 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 code | S-CQCC-N28 | S-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 11.43 mm | 11.43 mm | 31.877 mm | 31.877 mm | 11.43 mm | 31.877 mm | 11.43 mm |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 24 | 24 | 28 | 24 | 28 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN | WQCCN | DIP | DIP | QCCN | DIP | QCCN |
| Package shape | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER, WINDOW | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.8956 mm | 2.8956 mm | 5.08 mm | 5.08 mm | 1.9812 mm | 5.08 mm | 1.9812 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) - hot dipped |
| Terminal form | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD |
| width | 11.43 mm | 11.43 mm | 7.62 mm | 7.62 mm | 11.43 mm | 7.62 mm | 11.43 mm |
| Maker | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | - | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
| Maximum access time | 15 ns | - | 12 ns | 15 ns | 12 ns | 15 ns | 15 ns |
| Filter level | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
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