5962-8981502LA datasheet, PDF - EEWORLD Datasheet

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5962-8981502LA: DescriptionUVPROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24; Categorystorage storage; File Size334KB，8 Pages; ManufacturerCypress Semiconductor

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5962-8981502LA Overview

UVPROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24

5962-8981502LA Parametric

Parameter Name	Attribute value
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	12 ns
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	31.877 mm
memory density	16384 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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5962-8981502LA Related Products

	5962-8981502LA	5962-89815023A	5962-8981501LA	5962-89815013A	5962-88735043A	5962-8873503LA	5962-88735033A
Description	UVPROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24	UVPROM, 2KX8, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28	UVPROM, 2KX8, 15ns, CMOS, CDIP24, CERAMIC, DIP-24	UVPROM, 2KX8, 15ns, CMOS, CQCC28, CERAMIC, LCC-28	OTP ROM, 2KX8, 12ns, CMOS, CQCC28, CERAMIC, QCC-28	OTP ROM, 2KX8, 15ns, CMOS, CDIP24, CERAMIC, DIP-24	OTP ROM, 2KX8, 15ns, CMOS, CQCC28, CERAMIC, QCC-28
Parts packaging code	DIP	QLCC	DIP	QLCC	QLCC	DIP	QLCC
package instruction	DIP,	WQCCN,	DIP,	QCCN,	QCCN,	DIP,	CERAMIC, QCC-28
Contacts	24	28	24	28	28	24	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-GDIP-T24	S-CQCC-N28	R-GDIP-T24	S-CQCC-N28	S-CQCC-N28	R-GDIP-T24	S-CQCC-N28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	31.877 mm	11.43 mm	31.877 mm	11.43 mm	11.43 mm	31.877 mm	11.43 mm
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	24	28	24	28	28	24	28
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	WQCCN	DIP	QCCN	QCCN	DIP	QCCN
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE
Package form	IN-LINE	CHIP CARRIER, WINDOW	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	2.8956 mm	5.08 mm	2.8956 mm	1.9812 mm	5.08 mm	1.9812 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	QUAD	QUAD	DUAL	QUAD
width	7.62 mm	11.43 mm	7.62 mm	11.43 mm	11.43 mm	7.62 mm	11.43 mm
Maker	Cypress Semiconductor	Cypress Semiconductor	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Maximum access time	12 ns	-	15 ns	15 ns	12 ns	15 ns	15 ns
Filter level	MIL-STD-883	-	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Base Number Matches	1	1	1	1	1	1	-

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