|
74HCT147DB-T |
74HC147NB |
74HCT147NB |
74HCT147DB |
74HCT147PW-T |
74HC147PW-T |
74HC147PW |
74HCT147PW |
| Description |
IC HCT SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit |
IC HC/UH SERIES, 9-BIT ENCODER, PDIP16, Arithmetic Circuit |
IC HCT SERIES, 9-BIT ENCODER, PDIP16, Arithmetic Circuit |
IC HCT SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit |
IC HCT SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit |
IC HC/UH SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit |
IC HC/UH SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit |
IC HCT SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit |
| package instruction |
SSOP, |
DIP, |
DIP, |
SSOP, |
TSSOP, |
TSSOP, |
TSSOP, |
TSSOP, |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
| Other features |
9 TO 4 LINE PRIORITY ENCODER |
9 TO 4 LINE PRIORITY ENCODER |
9 TO 4 LINE PRIORITY ENCODER |
9 TO 4 LINE PRIORITY ENCODER |
9 TO 4 LINE PRIORITY ENCODER |
9 TO 4 LINE PRIORITY ENCODER |
9 TO 4 LINE PRIORITY ENCODER |
9 TO 4 LINE PRIORITY ENCODER |
| series |
HCT |
HC/UH |
HCT |
HCT |
HCT |
HC/UH |
HC/UH |
HCT |
| JESD-30 code |
R-PDSO-G16 |
R-PDIP-T16 |
R-PDIP-T16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
| length |
6.2 mm |
19.025 mm |
19.025 mm |
6.2 mm |
5 mm |
5 mm |
5 mm |
5 mm |
| Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
| Logic integrated circuit type |
ENCODER |
ENCODER |
ENCODER |
ENCODER |
ENCODER |
ENCODER |
ENCODER |
ENCODER |
| Number of digits |
9 |
9 |
9 |
9 |
9 |
9 |
9 |
9 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
SSOP |
DIP |
DIP |
SSOP |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, SHRINK PITCH |
IN-LINE |
IN-LINE |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| propagation delay (tpd) |
53 ns |
48 ns |
53 ns |
53 ns |
53 ns |
48 ns |
48 ns |
53 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
2 mm |
4.2 mm |
4.2 mm |
2 mm |
1.1 mm |
1.1 mm |
1.1 mm |
1.1 mm |
| Maximum supply voltage (Vsup) |
5.5 V |
6 V |
5.5 V |
5.5 V |
5.5 V |
6 V |
6 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
2 V |
4.5 V |
4.5 V |
4.5 V |
2 V |
2 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
NO |
NO |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
| Terminal form |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.65 mm |
2.54 mm |
2.54 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
| width |
5.3 mm |
7.62 mm |
7.62 mm |
5.3 mm |
4.4 mm |
4.4 mm |
4.4 mm |
4.4 mm |
| Maker |
NXP |
NXP |
NXP |
NXP |
- |
NXP |
NXP |
NXP |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
- |