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524-AG66D

Description
SOCKET, DIP24, IC SOCKET
Categorysocket   
File Size125KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric Compare View All

524-AG66D Overview

SOCKET, DIP24, IC SOCKET

524-AG66D Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTE Connectivity
Reach Compliance Codeunknown
ECCN codeEAR99
Contact to complete cooperationGOLD (25)
Contact completed and terminatedTIN LEAD
Contact materialNOT SPECIFIED
Device slot typeIC SOCKET
Type of equipment usedDIP24
Shell materialPOLYETHYLENE POLYESTER
JESD-609 codee0
Manufacturer's serial number524-AG66D
Number of contacts24
Base Number Matches1
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524-AG66D Product Details
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524-AG66D
(2-1437532-5)
T E I nternal N umber: 2 - 1 4 3 7 5 3 2 - 5
Product Highlights:
l
Socket Style = Standard
l
Through Hole C ontact Termination Type
l
2.54 mm C enterline
l
Row-to-Row Spacing = 10.16 mm
l
24 Positions
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Superseded
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
l
Product Line Information
Related Products:
l
Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
l
Socket Style
= Standard
l
Number of Positions
= 24
l
Profile = Standard
l
Frame Style
= C losed
l
Leg Style
= Straight
l
Sleeve Material = Brass/C opper
l
Product Series = 500 Series
Electrical Characteristics:
l
Insulation Resistance (M?) = 5,000
l
C ontact Resistance (m?) = 10
Termination Related Features:
l
Termination Post Length (mm [in])
= 3.18 [0.125]
l
Solder Tail C ontact Plating = Tin-Lead
Body Related Features:
l
C enterline (mm [in])
= 2.54 [0.100]
l
Row-to-Row Spacing (mm [in])
= 10.16 [0.400]
l
Mount Style
= Vertical
Contact Related Features:
l
C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
l
C ontact Plating, Mating Area, Material
= Gold (25)
l
C ontact Style
= Screw Machine
l
Mating C ontact Type
= Four-Fingered
Configuration Related Features:
l
Height Above PC Board (mm [in])
= 4.57 [0.180]
Industry Standards:
l
RoHS/ELV C ompliance
= Not ELV/RoHS compliant
l
Lead Free Solder Processes
= Wave solder capable to 240?C , Wave
solder capable to 260?C , Wave solder capable to 265?C
Conditions for Usage:
l
Temperature Range (?C ) = 125
Packaging Related Features:
l
Packaging Method
= Tube
Other:
l
Brand = AMP
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524-AG66D Related Products

524-AG66D 2-1437532-5
Description SOCKET, DIP24, IC SOCKET SOCKET, DIP24, IC SOCKET
Is it Rohs certified? incompatible incompatible
Maker TE Connectivity TE Connectivity
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Contact to complete cooperation GOLD (25) GOLD (25)
Contact completed and terminated TIN LEAD TIN LEAD
Contact material NOT SPECIFIED BERYLLIUM COPPER
Device slot type IC SOCKET IC SOCKET
Type of equipment used DIP24 DIP24
JESD-609 code e0 e0
Manufacturer's serial number 524-AG66D 1437532
Number of contacts 24 24
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