71V67602S150BQI8 datasheet, PDF

Datasheet> All Categories > storage> storage> 71V67602S150BQI8

71V67602S150BQI8: DescriptionSRAM; Categorystorage storage; File Size515KB，23 Pages; ManufacturerIDT (Integrated Device Technology)

Download Datasheet Parametric Compare View All

71V67602S150BQI8 Overview

SRAM

71V67602S150BQI8 Parametric

Parameter Name	Attribute value
Maker	IDT (Integrated Device Technology)
package instruction	,
Reach Compliance Code	unknown
Base Number Matches	1

Preview

Download Datasheet

View All

256K X 36, 512K X 18

3.3V Synchronous SRAMs

2.5V I/O, Burst Counter

Pipelined Outputs, Single Cycle Deselect

IDT71V67602

IDT71V67802

Features

256K x 36, 512K x 18 memory configurations

Supports high system speed:

– 166MHz 3.5ns clock access time

– 150MHz 3.8ns clock access time

– 133MHz 4.2ns clock access time

LBO

input selects interleaved or linear burst mode

Self-timed write cycle with global write control (GW byte

GW),

BWE

write enable (BWE and byte writes (BW

BWE),

BWx)

3.3V core power supply

Power down controlled by ZZ input

2.5V I/O supply (V

DDQ

)

Packaged in a JEDEC Standard 100-pin plastic thin quad

flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch

ball grid array.

Description

The IDT71V67602/7802 are high-speed SRAMs organized as

256K x 36/512K x 18. The IDT71V676/78 SRAMs contain write, data,

address and control registers. Internal logic allows the SRAM to generate

a self-timed write based upon a decision which can be left until the end of

the write cycle.

The burst mode feature offers the highest level of performance to the

system designer, as the IDT71V67602/7802 can provide four cycles of

data for a single address presented to the SRAM. An internal burst address

counter accepts the first cycle address from the processor, initiating the

access sequence. The first cycle of output data will be pipelined for one

cycle before it is available on the next rising clock edge. If burst mode

operation is selected (ADV=LOW), the subsequent three cycles of output

data will be available to the user on the next three rising clock edges. The

order of these three addresses are defined by the internal burst counter

and the

LBO

input pin.

The IDT71V67602/7802 SRAMs utilize IDT’s latest high-performance

CMOS process and are packaged in a JEDEC standard 14mm x 20mm

100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array

(BGA) and 165 fine pitch ball grid array (fBGA).

Pin Description Summary

-A

Address Inputs

Chip Enable

Chip Selects

Output Enable

Global Write Enable

Byte Write Enable

Individual Byte Write Selects

Clock

Burst Address Advance

Address Status (Cache Controller)

Address Status (Processor)

Linear / Interleaved Burst Order

Sleep Mode

Data Input / Output

Core Power, I/O Power

Ground

Input

I/O

Supply

Synchronous

Asynchronous

Synchronous

N/A

Synchronous

Asynchronous

Synchronous

N/A

5311 tbl 01

BWE

(1)

CLK

ADV

ADSC

ADSP

LBO

I/O

-I/O

, I/O

-I/O

, V

DDQ

NOTE:

and

are not applicable for the IDT71V67802.

FEBRUARY 2009

2003

DECEMBER

DSC-5311/07

71V67602S150BQI8 Related Products

	71V67602S150BQI8	71V67602S150BGI	71V67602S150BQI	71V67602S133BGI	71V67602S166PF	71V67602S133BQGI8	71V67602S133BQG8
Description	SRAM	Cache SRAM, 256KX36, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119	Cache SRAM, 256KX36, 3.8ns, CMOS, PBGA165, 13 X 15 MM, FPBGA-165	Cache SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119	Cache SRAM, 256KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	SRAM	SRAM
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
package instruction	,	14 X 22 MM, PLASTIC, MS-028AA, BGA-119	13 X 15 MM, FPBGA-165	14 X 22 MM, PLASTIC, MS-028AA, BGA-119	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	,	,
Reach Compliance Code	unknown	not_compliant	not_compliant	not_compliant	not_compliant	unknown	unknown
Base Number Matches	1	1	1	1	1	1	1
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	-	-
Parts packaging code	-	BGA	BGA	BGA	QFP	-	-
Contacts	-	119	165	119	100	-	-
ECCN code	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991	-	-
Maximum access time	-	3.8 ns	3.8 ns	4.2 ns	3.5 ns	-	-
Other features	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	-	-
Maximum clock frequency (fCLK)	-	150 MHz	150 MHz	133 MHz	166 MHz	-	-
I/O type	-	COMMON	COMMON	COMMON	COMMON	-	-
JESD-30 code	-	R-PBGA-B119	R-PBGA-B165	R-PBGA-B119	R-PQFP-G100	-	-
JESD-609 code	-	e0	e0	e0	e0	-	-
length	-	22 mm	15 mm	22 mm	20 mm	-	-
memory density	-	9437184 bit	9437184 bit	9437184 bit	9437184 bit	-	-
Memory IC Type	-	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	-	-
memory width	-	36	36	36	36	-	-
Humidity sensitivity level	-	3	3	3	3	-	-
Number of functions	-	1	1	1	1	-	-
Number of terminals	-	119	165	119	100	-	-
word count	-	262144 words	262144 words	262144 words	262144 words	-	-
character code	-	256000	256000	256000	256000	-	-
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	-
Maximum operating temperature	-	85 °C	85 °C	85 °C	70 °C	-	-
organize	-	256KX36	256KX36	256KX36	256KX36	-	-
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE	-	-
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-
encapsulated code	-	BGA	TBGA	BGA	LQFP	-	-
Encapsulate equivalent code	-	BGA119,7X17,50	BGA165,11X15,40	BGA119,7X17,50	QFP100,.63X.87	-	-
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-
Package form	-	GRID ARRAY	GRID ARRAY, THIN PROFILE	GRID ARRAY	FLATPACK, LOW PROFILE	-	-
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	-
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	225	NOT SPECIFIED	240	-	-
power supply	-	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	-	-
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-
Maximum seat height	-	2.36 mm	1.2 mm	2.36 mm	1.6 mm	-	-
Maximum standby current	-	0.05 A	0.05 A	0.07 A	0.05 A	-	-
Minimum standby current	-	3.14 V	3.14 V	3.14 V	3.14 V	-	-
Maximum slew rate	-	0.325 mA	0.325 mA	0.28 mA	0.34 mA	-	-
Maximum supply voltage (Vsup)	-	3.465 V	3.465 V	3.465 V	3.465 V	-	-
Minimum supply voltage (Vsup)	-	3.135 V	3.135 V	3.135 V	3.135 V	-	-
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V	3.3 V	-	-
surface mount	-	YES	YES	YES	YES	-	-
technology	-	CMOS	CMOS	CMOS	CMOS	-	-
Temperature level	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	-	-
Terminal surface	-	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn85Pb15)	-	-
Terminal form	-	BALL	BALL	BALL	GULL WING	-	-
Terminal pitch	-	1.27 mm	1 mm	1.27 mm	0.65 mm	-	-
Terminal location	-	BOTTOM	BOTTOM	BOTTOM	QUAD	-	-
Maximum time at peak reflow temperature	-	NOT SPECIFIED	20	NOT SPECIFIED	20	-	-
width	-	14 mm	13 mm	14 mm	14 mm	-	-

Recommended Resources

Simple light-emitting display logic pen circuit

LT1013/LT1014 type operational amplifier circuit

2~35V, 10A adjustable regulated power supply composed of MPC1000

HT7603 internal circuit schematic diagram

Simple single button switch circuit (error corrected)

Supercapacitor withstand voltage test: The supercapacitor withstand voltage test setting time is 60S, and the leakage current is 5mA. Will the withstand voltage test fail because the capacitor charging time is too long? ? ?...; tkyl01 Power technology

MSP432P401R REV C Update~: Because I didn't pay attention to the CCS version's support for XMS, I changed the CCS version, which resulted in the inability to debug XMS432P401 correctly. I had to apply for a sample to change to ...; 蓝雨夜 Microcontroller MCU

IT Urgent Recruitment: SB062. Position Name: Host Storage Senior Engineer Job Description: 1. Bachelor degree or above in computer science or related majors; 2. More than 5 years of system integration work background, with ...; iwtxk_tq Embedded System

External network access to embedded web server: Hi everyone, I integrated a web server in the winCE 5.0 system of Youshan 2440, connected it to the router (wireless router) with an Ethernet cable, and after setting up DMZ, I can access the web page...; wfiu Embedded System

Dear experts, can I run the DSP2808 program on the 2407 platform? If so, what should I pay attention to?: [i=s] This post was last edited by xuwentan on 2015-11-20 16:28 [/i] I wrote a three-way PWM wave based on 2808 for motor control, but the 2808 board has problems. I have a 2407 development board and ...; xuwentan Microcontroller MCU

A little sadness, a little pain: I feel sad to condense a PCB with the original size of 220mm×150mm to 120mm×60mm. The digital tube display, LED indicator, button, and connector terminals are all through-hole components....; qq849682862 Talking about work

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components