IC AC SERIES, DUAL 4-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14, Gate
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| package instruction | PLASTIC, DIP-14 |
| Reach Compliance Code | unknown |
| series | AC |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e0 |
| length | 19.18 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.012 A |
| Number of functions | 2 |
| Number of entries | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 10 ns |
| propagation delay (tpd) | 9 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 74AC20PCQR | 54AC20FMQB | 54AC20DMQB | HMTSW-209-06-G-Q-200-LA | 74AC20FCQR | |
|---|---|---|---|---|---|
| Description | IC AC SERIES, DUAL 4-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14, Gate | IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate | IC AC SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14, Gate | Board Stacking Connector, 18 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal, ROHS COMPLIANT | IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate |
| package instruction | PLASTIC, DIP-14 | DFP, FL14,.3 | DIP, DIP14,.3 | ROHS COMPLIANT | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 5.08 mm | 1.27 mm |
| Is it Rohs certified? | incompatible | incompatible | incompatible | conform to | - |
| Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | - | - | National Semiconductor(TI ) |
| series | AC | AC | AC | - | AC |
| JESD-30 code | R-PDIP-T14 | R-GDFP-F14 | R-GDIP-T14 | - | R-GDFP-F14 |
| JESD-609 code | e0 | e0 | e0 | e4 | - |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | - | 50 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | - | NAND GATE |
| MaximumI(ol) | 0.012 A | 0.012 A | 0.012 A | - | - |
| Number of functions | 2 | 2 | 2 | - | 2 |
| Number of entries | 4 | 4 | 4 | - | 4 |
| Number of terminals | 14 | 14 | 14 | - | 14 |
| Maximum operating temperature | 85 °C | 125 °C | 125 °C | - | 85 °C |
| Minimum operating temperature | -40 °C | -55 °C | -55 °C | - | -40 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DFP | DIP | - | DFP |
| Encapsulate equivalent code | DIP14,.3 | FL14,.3 | DIP14,.3 | - | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | IN-LINE | - | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| power supply | 3.3/5 V | 3.3/5 V | 3.3/5 V | - | - |
| Prop。Delay @ Nom-Sup | 10 ns | 11 ns | 11 ns | - | - |
| propagation delay (tpd) | 9 ns | 10 ns | 10 ns | - | 9 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| Schmitt trigger | NO | NO | NO | - | - |
| Maximum seat height | 5.08 mm | 2.032 mm | 5.08 mm | - | 2.032 mm |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | - | 6 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | - | 2 V |
| Nominal supply voltage (Vsup) | 3.3 V | 5 V | 5 V | - | 3.3 V |
| surface mount | NO | YES | NO | - | YES |
| technology | CMOS | CMOS | CMOS | - | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | MILITARY | - | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | - | FLAT |
| Terminal location | DUAL | DUAL | DUAL | - | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| width | 7.62 mm | 6.2865 mm | 7.62 mm | - | 6.2865 mm |
| Base Number Matches | 1 | 1 | 1 | - | 1 |