IC AC SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14, Gate
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| series | AC |
| JESD-30 code | R-GDIP-T14 |
| JESD-609 code | e0 |
| length | 19.43 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.012 A |
| Number of functions | 2 |
| Number of entries | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| method of packing | TUBE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 11 ns |
| propagation delay (tpd) | 10 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 54AC20DMQB | 54AC20FMQB | HMTSW-209-06-G-Q-200-LA | 74AC20FCQR | 74AC20PCQR | |
|---|---|---|---|---|---|
| Description | IC AC SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14, Gate | IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate | Board Stacking Connector, 18 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal, ROHS COMPLIANT | IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate | IC AC SERIES, DUAL 4-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14, Gate |
| package instruction | DIP, DIP14,.3 | DFP, FL14,.3 | ROHS COMPLIANT | DFP, | PLASTIC, DIP-14 |
| Reach Compliance Code | unknown | unknown | compliant | unknown | unknown |
| Terminal pitch | 2.54 mm | 1.27 mm | 5.08 mm | 1.27 mm | 2.54 mm |
| Is it Rohs certified? | incompatible | incompatible | conform to | - | incompatible |
| series | AC | AC | - | AC | AC |
| JESD-30 code | R-GDIP-T14 | R-GDFP-F14 | - | R-GDFP-F14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e4 | - | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | - | 50 pF | 50 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | - | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.012 A | 0.012 A | - | - | 0.012 A |
| Number of functions | 2 | 2 | - | 2 | 2 |
| Number of entries | 4 | 4 | - | 4 | 4 |
| Number of terminals | 14 | 14 | - | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | - | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | -40 °C | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | DIP | DFP | - | DFP | DIP |
| Encapsulate equivalent code | DIP14,.3 | FL14,.3 | - | - | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | - | FLATPACK | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| power supply | 3.3/5 V | 3.3/5 V | - | - | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 11 ns | 11 ns | - | - | 10 ns |
| propagation delay (tpd) | 10 ns | 10 ns | - | 9 ns | 9 ns |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | - | - | NO |
| Maximum seat height | 5.08 mm | 2.032 mm | - | 2.032 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 6 V | 6 V | - | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | - | 2 V | 2 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - | 3.3 V | 3.3 V |
| surface mount | NO | YES | - | YES | NO |
| technology | CMOS | CMOS | - | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | - | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | - | FLAT | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | - | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| width | 7.62 mm | 6.2865 mm | - | 6.2865 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | - | 1 | 1 |
| Maker | - | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
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