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74H106FCQR

Description
J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, CDFP16,
Categorylogic   
File Size120KB,2 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

74H106FCQR Overview

J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, CDFP16,

74H106FCQR Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerFairchild
package instructionDFP, FL16,.3
Reach Compliance Codecompliant
JESD-30 codeR-XDFP-F16
JESD-609 codee0
Logic integrated circuit typeJ-K FLIP-FLOP
Humidity sensitivity level2A
Number of functions2
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL16,.3
Package shapeRECTANGULAR
Package formFLATPACK
Peak Reflow Temperature (Celsius)250
surface mountYES
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
Trigger typeNEGATIVE EDGE
Base Number Matches1

74H106FCQR Related Products

74H106FCQR 74H106FCQM 74H106PCQM 74H106PCQR
Description J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, CDFP16, J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, CDFP16, J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, PDIP16, J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, PDIP16,
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DFP, FL16,.3 DFP, FL16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code compliant compliant compliant compliant
JESD-30 code R-XDFP-F16 R-XDFP-F16 R-PDIP-T16 R-PDIP-T16
JESD-609 code e0 e0 e0 e0
Logic integrated circuit type J-K FLIP-FLOP J-K FLIP-FLOP J-K FLIP-FLOP J-K FLIP-FLOP
Humidity sensitivity level 2A 2A 2A 2A
Number of functions 2 2 2 2
Number of terminals 16 16 16 16
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DFP DFP DIP DIP
Encapsulate equivalent code FL16,.3 FL16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) 250 250 250 250
surface mount YES YES NO NO
technology TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT FLAT THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30
Trigger type NEGATIVE EDGE NEGATIVE EDGE NEGATIVE EDGE NEGATIVE EDGE
Base Number Matches 1 1 1 1
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