NAND Gate, LS Series, 3-Func, 3-Input, TTL, PDIP14, PLASTIC, DIP-14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| Parts packaging code | DIP |
| package instruction | PLASTIC, DIP-14 |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| series | LS |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | NAND GATE |
| Number of functions | 3 |
| Number of entries | 3 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| propagation delay (tpd) | 15 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| 74LS10PC | 7410DC | 7410FC | 7410PC | 54S10DMQB | 54S10FM | 74LS10DC | 74LS10FC | 74H10FC | |
|---|---|---|---|---|---|---|---|---|---|
| Description | NAND Gate, LS Series, 3-Func, 3-Input, TTL, PDIP14, PLASTIC, DIP-14 | NAND Gate, 74 Series, 3-Func, 3-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, TTL, CDFP14, | NAND Gate, 74 Series, 3-Func, 3-Input, TTL, PDIP14, PLASTIC, DIP-14 | NAND Gate, S Series, 3-Func, 3-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, TTL, CDFP14, | NAND Gate, TTL, CDIP14, | NAND Gate, TTL, CDFP14, | NAND Gate, TTL, CDFP14, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| Reach Compliance Code | unknown | unknown | compliant | unknown | unknown | compliant | compliant | compliant | compliant |
| JESD-30 code | R-PDIP-T14 | R-CDIP-T14 | R-XDFP-F14 | R-PDIP-T14 | R-GDIP-T14 | R-XDFP-F14 | R-XDIP-T14 | R-XDFP-F14 | R-XDFP-F14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DFP | DIP | DIP | DFP | DIP | DFP | DFP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK | FLATPACK |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| surface mount | NO | NO | YES | NO | NO | YES | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | FLAT |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| package instruction | PLASTIC, DIP-14 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | - | - | DFP, FL14,.3 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | 250 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 250 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 30 |
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