Standard SRAM, 16KX1, 25ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20
| Parameter Name | Attribute value |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 25 ns |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| length | 25.3365 mm |
| memory density | 16384 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Number of functions | 1 |
| Number of terminals | 20 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 16KX1 |
| Package body material | UNSPECIFIED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 8413206RX | 8413209RX | IDT6167SA15DBG | 8413204RX | 8413205RX | IDT6167LA15DBG | |
|---|---|---|---|---|---|---|
| Description | Standard SRAM, 16KX1, 25ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20 | Standard SRAM, 16KX1, 45ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20 | Standard SRAM, 16KX1, 15ns, CMOS, CDIP20, 0.300 INCH, CERDIP-20 | Standard SRAM, 16KX1, 35ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20 | Standard SRAM, 16KX1, 35ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20 | Standard SRAM, 16KX1, 15ns, CMOS, CDIP20, 0.300 INCH, CERDIP-20 |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, | DIP, | 0.300 INCH, CERDIP-20 | DIP, | DIP, | 0.300 INCH, CERDIP-20 |
| Contacts | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | compliant | unknown | unknown | compliant |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 25 ns | 45 ns | 15 ns | 35 ns | 35 ns | 15 ns |
| JESD-30 code | R-XDIP-T20 | R-XDIP-T20 | R-GDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-GDIP-T20 |
| JESD-609 code | e0 | e0 | e3 | e0 | e0 | e3 |
| length | 25.3365 mm | 25.3365 mm | 25.3365 mm | 25.3365 mm | 25.3365 mm | 25.3365 mm |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 |
| word count | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| character code | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 16KX1 | 16KX1 | 16KX1 | 16KX1 | 16KX1 | 16KX1 |
| Package body material | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD | MATTE TIN |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Filter level | MIL-STD-883 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 | - |
| Peak Reflow Temperature (Celsius) | - | NOT APPLICABLE | 260 | - | NOT APPLICABLE | 260 |
| Maximum time at peak reflow temperature | - | NOT APPLICABLE | 30 | - | NOT APPLICABLE | 30 |
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