8413209RX datasheet, PDF - EEWORLD Datasheet

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8413209RX: DescriptionStandard SRAM, 16KX1, 45ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20; Categorystorage storage; File Size205KB，8 Pages; ManufacturerIDT (Integrated Device Technology)

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8413209RX Overview

Standard SRAM, 16KX1, 45ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20

8413209RX Parametric

Parameter Name	Attribute value
Maker	IDT (Integrated Device Technology)
Parts packaging code	DIP
package instruction	DIP,
Contacts	20
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	45 ns
JESD-30 code	R-XDIP-T20
JESD-609 code	e0
length	25.3365 mm
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	1
Humidity sensitivity level	1
Number of functions	1
Number of terminals	20
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX1
Package body material	UNSPECIFIED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT APPLICABLE
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT APPLICABLE
width	7.62 mm
Base Number Matches	1

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Description	Standard SRAM, 16KX1, 45ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20	Standard SRAM, 16KX1, 25ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20	Standard SRAM, 16KX1, 15ns, CMOS, CDIP20, 0.300 INCH, CERDIP-20	Standard SRAM, 16KX1, 35ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20	Standard SRAM, 16KX1, 35ns, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20	Standard SRAM, 16KX1, 15ns, CMOS, CDIP20, 0.300 INCH, CERDIP-20
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP,	DIP,	0.300 INCH, CERDIP-20	DIP,	DIP,	0.300 INCH, CERDIP-20
Contacts	20	20	20	20	20	20
Reach Compliance Code	unknown	unknown	compliant	unknown	unknown	compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	45 ns	25 ns	15 ns	35 ns	35 ns	15 ns
JESD-30 code	R-XDIP-T20	R-XDIP-T20	R-GDIP-T20	R-XDIP-T20	R-XDIP-T20	R-GDIP-T20
JESD-609 code	e0	e0	e3	e0	e0	e3
length	25.3365 mm	25.3365 mm	25.3365 mm	25.3365 mm	25.3365 mm	25.3365 mm
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	16KX1	16KX1	16KX1	16KX1	16KX1	16KX1
Package body material	UNSPECIFIED	UNSPECIFIED	CERAMIC, GLASS-SEALED	UNSPECIFIED	UNSPECIFIED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	MATTE TIN	TIN LEAD	TIN LEAD	MATTE TIN
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Base Number Matches	1	1	1	1	1	1
Peak Reflow Temperature (Celsius)	NOT APPLICABLE	-	260	-	NOT APPLICABLE	260
Filter level	MIL-STD-883	MIL-STD-883	-	MIL-STD-883	MIL-STD-883	-
Maximum time at peak reflow temperature	NOT APPLICABLE	-	30	-	NOT APPLICABLE	30

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