82S191A/B3A datasheet, PDF - EEWORLD Datasheet

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82S191A/B3A: DescriptionIC 2K X 8 OTPROM, 55 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM; Categorystorage; File Size94KB，4 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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82S191A/B3A Overview

IC 2K X 8 OTPROM, 55 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM

82S191A/B3A Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	QLCC
package instruction	QCCN,
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	55 ns
JESD-30 code	S-CQCC-N28
length	11.43 mm
memory density	16384 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.905 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.43 mm
Base Number Matches	1

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Description	IC 2K X 8 OTPROM, 55 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM	IC 2K X 8 OTPROM, 55 ns, CDFP24, CERAMIC, FP-24, Programmable ROM	IC 2K X 8 OTPROM, 55 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM	IC 2K X 8 OTPROM, 100 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM	IC 2K X 8 OTPROM, 100 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM	IC 2K X 8 OTPROM, 100 ns, CDIP24, 0.300 INCH, CERAMIC, DIP-24, Programmable ROM	IC 2K X 8 OTPROM, 55 ns, CDIP24, 0.300 INCH, CERAMIC, DIP-24, Programmable ROM	IC 2K X 8 OTPROM, 100 ns, CDFP24, CERAMIC, FP-24, Programmable ROM
Parts packaging code	QLCC	DFP	DIP	QLCC	DIP	DIP	DIP	DFP
package instruction	QCCN,	DFP,	DIP,	QCCN,	DIP,	DIP,	DIP,	DFP,
Contacts	28	24	24	28	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	55 ns	55 ns	55 ns	100 ns	100 ns	100 ns	55 ns	100 ns
JESD-30 code	S-CQCC-N28	R-CDFP-F24	R-GDIP-T24	S-CQCC-N28	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-CDFP-F24
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	24	24	28	24	24	24	24
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	DFP	DIP	QCCN	DIP	DIP	DIP	DFP
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.905 mm	2.286 mm	5.715 mm	1.905 mm	5.715 mm	5.08 mm	5.08 mm	2.286 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	NO	NO	NO	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	FLAT	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
width	11.43 mm	9.144 mm	15.24 mm	11.43 mm	15.24 mm	7.62 mm	7.62 mm	9.144 mm
Maker	NXP	NXP	-	-	NXP	NXP	NXP	NXP

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