IC 2K X 8 OTPROM, 100 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM
| Parameter Name | Attribute value |
| Parts packaging code | QLCC |
| package instruction | QCCN, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 100 ns |
| JESD-30 code | S-CQCC-N28 |
| length | 11.43 mm |
| memory density | 16384 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 1.905 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 11.43 mm |
| Base Number Matches | 1 |
| 82S191/B3A | 82S191A/BKA | 82S191A/B3A | 82S191A/BJA | 82S191/BJA | 82S191/BLA | 82S191A/BLA | 82S191/BKA | |
|---|---|---|---|---|---|---|---|---|
| Description | IC 2K X 8 OTPROM, 100 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM | IC 2K X 8 OTPROM, 55 ns, CDFP24, CERAMIC, FP-24, Programmable ROM | IC 2K X 8 OTPROM, 55 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM | IC 2K X 8 OTPROM, 55 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM | IC 2K X 8 OTPROM, 100 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM | IC 2K X 8 OTPROM, 100 ns, CDIP24, 0.300 INCH, CERAMIC, DIP-24, Programmable ROM | IC 2K X 8 OTPROM, 55 ns, CDIP24, 0.300 INCH, CERAMIC, DIP-24, Programmable ROM | IC 2K X 8 OTPROM, 100 ns, CDFP24, CERAMIC, FP-24, Programmable ROM |
| Parts packaging code | QLCC | DFP | QLCC | DIP | DIP | DIP | DIP | DFP |
| package instruction | QCCN, | DFP, | QCCN, | DIP, | DIP, | DIP, | DIP, | DFP, |
| Contacts | 28 | 24 | 28 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 100 ns | 55 ns | 55 ns | 55 ns | 100 ns | 100 ns | 55 ns | 100 ns |
| JESD-30 code | S-CQCC-N28 | R-CDFP-F24 | S-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-CDFP-F24 |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 24 | 28 | 24 | 24 | 24 | 24 | 24 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN | DFP | QCCN | DIP | DIP | DIP | DIP | DFP |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.905 mm | 2.286 mm | 1.905 mm | 5.715 mm | 5.715 mm | 5.08 mm | 5.08 mm | 2.286 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | NO | NO | NO | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 11.43 mm | 9.144 mm | 11.43 mm | 15.24 mm | 15.24 mm | 7.62 mm | 7.62 mm | 9.144 mm |
| Maker | - | NXP | NXP | - | NXP | NXP | NXP | NXP |
京公网安备 11010802033920号
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