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5962-9669204HUX

Description
Flash, 512KX8, 70ns, CDFP32, CERAMIC, DFP-32
Categorystorage   
File Size654KB,11 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9669204HUX Overview

Flash, 512KX8, 70ns, CDFP32, CERAMIC, DFP-32

5962-9669204HUX Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDFP
package instructionCERAMIC, DFP-32
Contacts32
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time70 ns
Other featuresSECTOR ERASE; 10000 ERASE/PROGRAM CYCLES MIN
JESD-30 codeR-CDFP-F32
JESD-609 codee4
length20.83 mm
memory density4194304 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height2.777 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width10.41 mm
Base Number Matches1
WMF512K8-XXX5
512Kx8 MONOLITHIC NOR FLASH (SMD 5962-96692*)
FEATURES

Access Times of 60, 70, 90, 120, 150ns

Packaging
• 32 pin, Hermetic Ceramic, 0.600" DIP
(Package 300)
• 32 lead, Hermetic Ceramic, 0.400" SOJ
(Package 101)
• 32 pin, Rectangular Ceramic Leadless Chip Carrier
(Package 601)
• 32 lead Flatpack (Package 220)

100,000 Erase/Program Cycles Minimum

Sector Erase Architecture
• 8 equal size sectors of 64K bytes each
• Any combination of sectors can be concurrently erased.
Also supports full chip erase

Organized as 512Kx8

Commercial, Industrial and Military Temperature Ranges

5 Volt Programming.

Low Power CMOS

Embedded Erase and Program Algorithms

TTL Compatible Inputs and CMOS Outputs

Page Program Operation and Internal Program Control
Time.
Note: For programming information and waveforms refer to Flash Programming 4M5 Application
Note AN0037.
This product is subject to change without notice.
* For reference only – see table on page 9
PIN CONFIGURATION FOR WMF512K8-XXX5
32 DIP
32 CSOJ
32 FLATPACK
PIN CONFIGURATION FOR WMF512K8-XCLX5
32 CLCC
TOP VIEW
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
V
SS
TOP VIEW
V
CC
WE#
A17
A14
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
I/O5
I/O4
I/O3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
WE#
A12
A15
A16
A18
4 3 2 1 32 31 30
A7
A6
A5
A4
A3
A2
A1
A0
I/O
0
29
5
28
6
27
7
26
8
25
9
24
10
23
11
22
12
21
13
14 15 16 17 18 19 20
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
V
SS
A14
A13
A8
A9
A11
OE#
A10
CS#
I/O7
PIN DESCRIPTION
A
0
-
18
I/O
0-7
CS#
OE#
WE#
V
CC
V
SS
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
Microsemi Corporation reserves the right to change products or specifications without notice.
May 2012
Rev. 9
© 2012 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
A17
V
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