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824-AG31SM

Description
IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing
Categorysocket   
File Size27KB,2 Pages
ManufacturerThomas & Betts Corporation
Websitehttp://www.tnb.com/
Download Datasheet Parametric View All

824-AG31SM Overview

IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing

824-AG31SM Parametric

Parameter NameAttribute value
MakerThomas & Betts Corporation
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Other featuresBUTT STYLE TERMINALS
body width0.4 inch
subject depth0.105 inch
body length1.2 inch
Contact to complete cooperationAU
Contact completed and terminatedTIN OVER NICKEL
Contact materialBE-CU
Contact styleRND PIN-SKT
current rating3 A
Device slot typeIC SOCKET
Type of equipment usedDIP24
Dielectric withstand voltage1000VAC V
Shell materialPOLYESTER
Insulation resistance5000000000 Ω
Manufacturer's serial number800SM
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts24
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.3 mm
Terminal pitch2.54 mm
Base Number Matches1
800SM Series
A
Surface Mount DIP Sockets
814-AG11SM
FEATURES:
Augat offers the precision machined 800SM Series which achieves
compliancy to the board surface and is designed for high temperatures
typical of vapor phase and infrared reflow soldering.
• “Butt” style terminals float in plastic housing for compliancy
to board surface
• Precision four-fingered inner contacts provide concentric funnel entry
for easy flat or round insertion
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition II, 10 G's
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016
Inner Contact
Retention ................ 7.5 Lbs. per line average
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force .............. 179 Grams (6.3 oz.) average with a .018" (0,46)
dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)
dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms max.
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per
MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature .. Gold inner contact -55°C to +125°C,
Tin/lead inner contact -55°C to +105°C
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
• IC Pin Dimension Range: .009" x .015" (0,23 x 0,38) through
.011" x .020" (0,28 x 0,51)
.016" to .021" (0,41 to 0,53) round lead
.105" (2,67) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL rated 94V-0
Outer Sleeve .................. Brass
Contacts .......................... Beryllium copper
Sleeve Plating ................ Tin/lead
Contact Plating .............. Gold or tin/lead
Quality & Innovation From The
Product Group
A16
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805

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