MDE Semiconductor, Inc.
78-150 Calle Tampico, Unit 210 La Quinta, CA. U.S.A. 92253 Tel: 760-564-8656 • Fax: 760-564-2414
3KP SERIES
GLASS PASSIVATED JUNCTION TRANSIENT VOLTAGE SUPPRESSOR
VOLTAGE-5.0 TO 180 Volts
3000 Watt Peak Pulse Power
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94 V-O
• Glass passivated junction
• 3000W Peak Pulse Power
capability on 10/1000 µs waveform
• Glass passivated junction
• Low incremental surge resistance
• Excellent clamping capability
• Repetition rate (duty cycle): 0.05%
• Fast response time: typically less than
1.0 ps from 0 volts to BV
• Typical IR less than 1µA above 10V
• High temperature soldering guaranteed:
265°C/10 seconds/ .375", (9.5mm) lead
length, 5lbs., (2.3kg) tension
MECHANICAL DATA
Case: Molded plastic over glass passivated junction
Terminals: Plated Axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denoted positive end (cathode)
except Bipolar
Mounting Position: Any
Weight: 0.07 ounces, 2.1 grams
DEVICES FOR BIPOLAR APPLICATIONS
For Bidirectional use C or CA Suffix for types 3KP5.0 thru types 3KP180 (e.g. 3KP5.0C, 3KP180CA)
Electrical characteristics apply in both directions.
MAXIMUM RATINGS AND CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
RATING
SYMBOL
VALUE
UNITS
Peak Pulse Power Dissipation on 10/1000 µs
Minimum 3000
Watts
P
ppm
waveform
(NOTE 1, Fig.1)
Ippm
SEE TABLE 1
Amps
Peak Pulse Current of on 10/1000 µs waveform
(Note 1,Fig 3)
Steady State Power Dissipation at
T
L
= 75°C
8.0
Watts
P
m(AV)
Lead lengths .375", 9.5mm
(Note 2)
Peak Forward Surge Current, 8.3ms Single Half Sine-wave
250
Amps
I
FSM
Superimposed on Rated Load,
(JEDEC Method)(Note 3)
Operatings and Storage Temperature Range
Tj, Tstg
-55 +175
°C
NOTES:
1. Non-repetitive current pulse, per Fig.3 and derated above Ta=25 °C per Fig.2.
2. Mounted on Copper Pad area of 0.8x0.8" (20x20mm) per Fig.5.
3. 8.3ms single half sine-wave, or equivalent square wave, Duty cycle=4 pulses per minutes maximum.
6/12/01
Embedded System
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