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PI7C8150BND

Description
PCI BUS CONTROLLER, PBGA256
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1014KB,108 Pages
ManufacturerPericom Semiconductor Corporation (Diodes Incorporated)
Websitehttps://www.diodes.com/
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PI7C8150BND Overview

PCI BUS CONTROLLER, PBGA256

PI7C8150BND Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerPericom Semiconductor Corporation (Diodes Incorporated)
Parts packaging codeBGA
package instructionBGA, BGA256,16X16,40
Contacts256
Reach Compliance Codecompli
ECCN codeEAR99
Address bus width32
maximum clock frequency66 MHz
External data bus width32
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
Humidity sensitivity level1
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA256,16X16,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.76 mm
Maximum slew rate510 mA
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width17 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
PI7C8150B
ASYNCHRONOUS 2-PORT
PCI-to-PCI BRIDGE
REVISION 2.02
3545 North First Street, San Jose, CA 95134
Telephone: 1-877-PERICOM, (1-877-737-4266)
Fax: 408-435-1100
Internet:
http://www.pericom.com
06-0044

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Description PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256
Address bus width 32 32 32 32 32 32 32 32 32
External data bus width 32 32 32 32 32 32 32 32 32
Number of terminals 256 208 208 256 256 256 256 208 208
Maximum operating temperature 85 °C 85 °C 85 °C 85 Cel 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - - - 0.0 Cel -40 °C -40 °C - -40 °C -40 °C
surface mount YES YES YES Yes YES YES YES YES YES
Temperature level OTHER OTHER OTHER OTHER INDUSTRIAL INDUSTRIAL OTHER INDUSTRIAL INDUSTRIAL
Terminal form BALL GULL WING GULL WING BALL BALL BALL BALL GULL WING GULL WING
Terminal location BOTTOM QUAD QUAD BOTTOM BOTTOM BOTTOM BOTTOM QUAD QUAD
Is it lead-free? Contains lead Contains lead Contains lead - Lead free Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible - conform to incompatible incompatible incompatible incompatible
Maker Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) - Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated)
Parts packaging code BGA QFP QFP - BGA BGA BGA QFP QFP
package instruction BGA, BGA256,16X16,40 FQFP, QFP208,1.2SQ,20 FQFP, QFP208,1.2SQ,20 - BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 FQFP, QFP208,1.2SQ,20 FQFP, QFP208,1.2SQ,20
Contacts 256 208 208 - 256 256 256 208 208
Reach Compliance Code compli compli compli - compli compli compli compli compli
ECCN code EAR99 EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99
maximum clock frequency 66 MHz 33 MHz 66 MHz - 66 MHz 33 MHz 33 MHz 33 MHz 66 MHz
JESD-30 code S-PBGA-B256 S-PQFP-G208 S-PQFP-G208 - S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PQFP-G208 S-PQFP-G208
JESD-609 code e0 e0 e0 - e1 e0 - - -
length 17 mm 28 mm 28 mm - 17 mm 17 mm 17 mm 28 mm 28 mm
Humidity sensitivity level 1 3 3 - 3 3 - - -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA FQFP FQFP - BGA BGA BGA FQFP FQFP
Encapsulate equivalent code BGA256,16X16,40 QFP208,1.2SQ,20 QFP208,1.2SQ,20 - BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package shape SQUARE SQUARE SQUARE - SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY FLATPACK, FINE PITCH FLATPACK, FINE PITCH - GRID ARRAY GRID ARRAY GRID ARRAY FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius) 240 225 225 - 260 240 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.76 mm 3.8 mm 3.8 mm - 1.76 mm 1.76 mm 1.76 mm 3.8 mm 3.8 mm
Maximum slew rate 510 mA 510 mA 510 mA - 510 mA 510 mA 510 mA 510 mA 510 mA
Maximum supply voltage 3.6 V 3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V - 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
technology CMOS CMOS CMOS - CMOS CMOS CMOS CMOS CMOS
Terminal surface TIN LEAD TIN LEAD TIN LEAD - TIN SILVER COPPER TIN LEAD - - -
Terminal pitch 1 mm 0.5 mm 0.5 mm - 1 mm 1 mm 1 mm 0.5 mm 0.5 mm
Maximum time at peak reflow temperature NOT SPECIFIED 30 30 - 40 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 17 mm 28 mm 28 mm - 17 mm 17 mm 17 mm 28 mm 28 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI - BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
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