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PI7C8150B

Description
PCI BUS CONTROLLER, PBGA256
Categorysemiconductor    The embedded processor and controller   
File Size1014KB,108 Pages
ManufacturerPericom Semiconductor Corporation (Diodes Incorporated)
Websitehttps://www.diodes.com/
Download Datasheet Parametric Compare View All

PI7C8150B Overview

PCI BUS CONTROLLER, PBGA256

PI7C8150B Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals256
Maximum operating temperature85 Cel
Minimum operating temperature0.0 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage3 V
Rated supply voltage3.3 V
External data bus width32
Processing package descriptionPLASTIC, BGA-256
stateACTIVE
packaging shapeSQUARE
Package SizeGRID ARRAY
surface mountYes
Terminal formBALL
Terminal spacing1 mm
terminal coatingTIN LEAD
Terminal locationBOTTOM
Packaging MaterialsPLASTIC/EPOXY
Temperature levelOTHER
Address bus width32
Maximum FCLK clock frequency66 MHz
Microprocessor typePCI BUS CONTROLLER
PI7C8150B
ASYNCHRONOUS 2-PORT
PCI-to-PCI BRIDGE
REVISION 2.02
3545 North First Street, San Jose, CA 95134
Telephone: 1-877-PERICOM, (1-877-737-4266)
Fax: 408-435-1100
Internet:
http://www.pericom.com
06-0044

PI7C8150B Related Products

PI7C8150B PI7C8150BMA-33 PI7C8150BMA PI7C8150BND PI7C8150BNDIE PI7C8150BNDI-33 PI7C8150BND-33 PI7C8150BMAI-33 PI7C8150BMAI
Description PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256 PCI BUS CONTROLLER, PBGA256
Number of terminals 256 208 208 256 256 256 256 208 208
Maximum operating temperature 85 Cel 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature 0.0 Cel - - - -40 °C -40 °C - -40 °C -40 °C
External data bus width 32 32 32 32 32 32 32 32 32
surface mount Yes YES YES YES YES YES YES YES YES
Terminal form BALL GULL WING GULL WING BALL BALL BALL BALL GULL WING GULL WING
Terminal location BOTTOM QUAD QUAD BOTTOM BOTTOM BOTTOM BOTTOM QUAD QUAD
Temperature level OTHER OTHER OTHER OTHER INDUSTRIAL INDUSTRIAL OTHER INDUSTRIAL INDUSTRIAL
Address bus width 32 32 32 32 32 32 32 32 32
Is it lead-free? - Contains lead Contains lead Contains lead Lead free Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? - incompatible incompatible incompatible conform to incompatible incompatible incompatible incompatible
Maker - Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated)
Parts packaging code - QFP QFP BGA BGA BGA BGA QFP QFP
package instruction - FQFP, QFP208,1.2SQ,20 FQFP, QFP208,1.2SQ,20 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 FQFP, QFP208,1.2SQ,20 FQFP, QFP208,1.2SQ,20
Contacts - 208 208 256 256 256 256 208 208
Reach Compliance Code - compli compli compli compli compli compli compli compli
ECCN code - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
maximum clock frequency - 33 MHz 66 MHz 66 MHz 66 MHz 33 MHz 33 MHz 33 MHz 66 MHz
JESD-30 code - S-PQFP-G208 S-PQFP-G208 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PQFP-G208 S-PQFP-G208
JESD-609 code - e0 e0 e0 e1 e0 - - -
length - 28 mm 28 mm 17 mm 17 mm 17 mm 17 mm 28 mm 28 mm
Humidity sensitivity level - 3 3 1 3 3 - - -
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - FQFP FQFP BGA BGA BGA BGA FQFP FQFP
Encapsulate equivalent code - QFP208,1.2SQ,20 QFP208,1.2SQ,20 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package shape - SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form - FLATPACK, FINE PITCH FLATPACK, FINE PITCH GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius) - 225 225 240 260 240 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 3.8 mm 3.8 mm 1.76 mm 1.76 mm 1.76 mm 1.76 mm 3.8 mm 3.8 mm
Maximum slew rate - 510 mA 510 mA 510 mA 510 mA 510 mA 510 mA 510 mA 510 mA
Maximum supply voltage - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage - 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
technology - CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal surface - TIN LEAD TIN LEAD TIN LEAD TIN SILVER COPPER TIN LEAD - - -
Terminal pitch - 0.5 mm 0.5 mm 1 mm 1 mm 1 mm 1 mm 0.5 mm 0.5 mm
Maximum time at peak reflow temperature - 30 30 NOT SPECIFIED 40 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 28 mm 28 mm 17 mm 17 mm 17 mm 17 mm 28 mm 28 mm
uPs/uCs/peripheral integrated circuit type - BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
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