Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CQCC20, CERAMIC, LCC-20
| Parameter Name | Attribute value |
| Maker | Vishay |
| Parts packaging code | QLCC |
| package instruction | , |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | S-CQCC-N20 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of channels | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Nominal off-state isolation | 50 dB |
| Maximum on-state resistance (Ron) | 300 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | YES |
| Maximum disconnect time | 500 ns |
| Maximum connection time | 500 ns |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| 77052012A | DG508AAP/883{SOLDER-DIP} | DG508AAP/883(SOLDER-DIP) | DG508AAP/883(GOLD-PLATE) | DG508AAP/883{GOLD-PLATE} | DG508AAP | DG509ADY-T1 | DG508AAL | DG508AAL883B | DG509AAP/883 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CQCC20, CERAMIC, LCC-20 | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, Multiplexer or Switch | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16 | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, Multiplexer or Switch | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, Multiplexer or Switch | Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDSO16, SOIC-16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDFP16, | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16, DFP-16, Multiplexer or Switch | IC 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16, Multiplexer or Switch |
| package instruction | , | DIP, | DIP, | DIP, | DIP, | DIP, | SOP, | DFP, FL16,.3 | DFP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
| JESD-30 code | S-CQCC-N20 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-PDSO-G16 | R-XDFP-F16 | R-CDFP-F16 | R-CDIP-T16 |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| Number of channels | 8 | 8 | 8 | 8 | 8 | 8 | 4 | 8 | 8 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum on-state resistance (Ron) | 300 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 450 Ω | 500 Ω | 400 Ω | 400 Ω |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | FLATPACK | FLATPACK | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | YES | NO | NO | NO | NO | NO | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | FLAT | FLAT | THROUGH-HOLE |
| Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Vishay | Vishay | Vishay | Vishay | Vishay | Vishay | - | - | Vishay | Vishay |
| Nominal off-state isolation | 50 dB | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | - | 68 dB | 68 dB |
| Maximum disconnect time | 500 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns | - | - | 1000 ns | 1000 ns |
| Maximum connection time | 500 ns | 1500 ns | 1500 ns | 1500 ns | 1500 ns | 1500 ns | - | - | 1500 ns | 1500 ns |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| On-state resistance matching specifications | - | 14.4 Ω | 14.4 Ω | 14.4 Ω | 14.4 Ω | 14.4 Ω | 14.4 Ω | - | 14.4 Ω | 14.4 Ω |
| encapsulated code | - | DIP | DIP | DIP | DIP | DIP | SOP | DFP | DFP | DIP |
| Maximum supply current (Isup) | - | 2.4 mA | 2.4 mA | 2.4 mA | 2.4 mA | 2.4 mA | - | - | - | 2.4 mA |
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