54AC1010-70DM datasheet, PDF - EEWORLD Datasheet

54AC1010-70DM: DescriptionIC,MULTIPLIER/ACCUMULATOR,AC-CMOS,DIP,64PIN,CERAMIC; CategoryMicrocontrollers and processors; File Size548KB，10 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54AC1010-70DM Overview

IC,MULTIPLIER/ACCUMULATOR,AC-CMOS,DIP,64PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP64,.9
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 code	R-XDIP-T64
JESD-609 code	e0
Number of terminals	64
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP64,.9
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	3.3/5 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches	1

	54AC1010-70DM	54AC1010-70DMQB	54AC1010-60DM
Description	IC,MULTIPLIER/ACCUMULATOR,AC-CMOS,DIP,64PIN,CERAMIC	IC,MULTIPLIER/ACCUMULATOR,AC-CMOS,DIP,64PIN,CERAMIC	IC,MULTIPLIER/ACCUMULATOR,AC-CMOS,DIP,64PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP64,.9	DIP, DIP64,.9	DIP, DIP64,.9
Reach Compliance Code	unknown	unknown	unknown
Is Samacsys	N	N	N
JESD-30 code	R-XDIP-T64	R-XDIP-T64	R-XDIP-T64
JESD-609 code	e0	e0	e0
Number of terminals	64	64	64
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP
Encapsulate equivalent code	DIP64,.9	DIP64,.9	DIP64,.9
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
power supply	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches	1	1	1

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