EEWORLDEEWORLDEEWORLD

Part Number

Search

MB200

Description
Rectifiers
CategoryDiscrete semiconductor    diode   
File Size46KB,2 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

MB200 Online Shopping

Suppliers Part Number Price MOQ In stock  
MB200 - - View Buy Now

MB200 Overview

Rectifiers

MB200 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresMETALLURGICALLY BONDED
applicationULTRA FAST RECOVERY
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1 V
JESD-30 codeO-LALF-W2
JESD-609 codee0
Maximum non-repetitive peak forward current25 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Maximum output current2 A
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum power dissipation2 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage40 V
Maximum reverse current0.5 µA
Maximum reverse recovery time0.02 µs
surface mountNO
Terminal surfaceTIN LEAD
Terminal formWIRE
Terminal locationAXIAL
Maximum time at peak reflow temperatureNOT SPECIFIED

MB200 Related Products

MB200 MB207 MB208 MB206 MB204 MB201
Description Rectifiers Rectifiers Rectifiers Rectifiers Rectifiers Rectifiers
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Microsemi Microsemi Microsemi Microsemi Microsemi Microsemi
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Other features METALLURGICALLY BONDED METALLURGICALLY BONDED METALLURGICALLY BONDED METALLURGICALLY BONDED METALLURGICALLY BONDED METALLURGICALLY BONDED
application ULTRA FAST RECOVERY ULTRA FAST RECOVERY ULTRA FAST RECOVERY ULTRA FAST RECOVERY ULTRA FAST RECOVERY ULTRA FAST RECOVERY
Shell connection ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED
Configuration SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON
Diode type RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE
Maximum forward voltage (VF) 1 V 1 V 1 V 1 V 1 V 1 V
JESD-30 code O-LALF-W2 O-LALF-W2 O-LALF-W2 O-LALF-W2 O-LALF-W2 O-LALF-W2
JESD-609 code e0 e0 e0 e0 e0 e0
Maximum non-repetitive peak forward current 25 A 25 A 25 A 25 A 25 A 25 A
Number of components 1 1 1 1 1 1
Phase 1 1 1 1 1 1
Number of terminals 2 2 2 2 2 2
Maximum operating temperature 175 °C 175 °C 175 °C 175 °C 175 °C 175 °C
Minimum operating temperature -65 °C -65 °C -65 °C -65 °C -65 °C -65 °C
Maximum output current 2 A 2 A 2 A 2 A 2 A 2 A
Package body material GLASS GLASS GLASS GLASS GLASS GLASS
Package shape ROUND ROUND ROUND ROUND ROUND ROUND
Package form LONG FORM LONG FORM LONG FORM LONG FORM LONG FORM LONG FORM
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maximum power dissipation 2 W 2 W 2 W 2 W 2 W 2 W
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum repetitive peak reverse voltage 40 V 40 V 65 V 185 V 135 V 65 V
Maximum reverse current 0.5 µA 1 µA 1 µA 1.5 µA 0.5 µA 0.5 µA
Maximum reverse recovery time 0.02 µs 0.02 µs 0.02 µs 0.02 µs 0.02 µs 0.02 µs
surface mount NO NO NO NO NO NO
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form WIRE WIRE WIRE WIRE WIRE WIRE
Terminal location AXIAL AXIAL AXIAL AXIAL AXIAL AXIAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Chip optical transmission breaks through bottleneck: bandwidth density increases 10 to 50 times
Semiconductor microchips that integrate photonic and electronic components can speed up data transmission, improve performance and reduce power consumption, but due to process limitations, they have n...
john_wang RF/Wirelessly
Is this Windows formatting the nand flash?
After each flash of wince, the following debug infomation output prompts: INFO: Initializing system interrupts... INFO: Initializing system clock(s)... INFO: Initializing driver globals area... SDMMC ...
batonsoft Embedded System
c-spy always makes this mistake
I used MSP430F1222 which I soldered myself. Sometimes the program can be downloaded, but sometimes it cannot.For example: Error during erase of information memory. Retry erase operation?Another exampl...
20030201 Microcontroller MCU
Question A of the 2011 National Electronic Competition, how efficient have you been?
[i=s] This post was last edited by paulhyde on 2014-9-15 03:52 [/i] Is there anyone who can achieve 90%+? We can only achieve 78%...
贰雨儿 Electronics Design Contest
The Data Conversion HandbookDownload
[table=98%][tr][td][i][font=Arial][size=2]绝对够经典的教材。我从ADI官网下的,免费提供给大家~[/size][/font][/i] [i][font=Arial][size=2]其实ADI官网也是免费[/size][/font][/i] [i][font=Arial][size=2][/size][/font][/i][i][font=Arial][si...
zhangang Analog electronics
Electric vehicle charging port communication protocol
EEWORLD, everyone: Does anyone know about the communication protocol of electric vehicle charging port? Some say it is CAN bus, some say it is RS485? Which one is it? In addition, are the protocols of...
Gen_X Switching Power Supply Study Group

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2277  2104  1595  2321  1410  46  43  33  47  29 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号