EEWORLDEEWORLDEEWORLD

Part Number

Search

346-44-125-41-012000

Description
IC & Component Sockets Interconnect Socket
CategoryThe connector    socket   
File Size409KB,1 Pages
ManufacturerMill-Max
Websitehttps://www.mill-max.com
Environmental Compliance
Download Datasheet Parametric View All

346-44-125-41-012000 Online Shopping

Suppliers Part Number Price MOQ In stock  
346-44-125-41-012000 - - View Buy Now

346-44-125-41-012000 Overview

IC & Component Sockets Interconnect Socket

346-44-125-41-012000 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMill-Max
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresSIP SOCKET
Contact to complete cooperationTIN (200)
Contact completed and terminatedTin (Sn)
Contact materialNOT SPECIFIED
Device slot typeIC SOCKET
Type of equipment usedSIP25
Shell materialPOLYETHYLENE
JESD-609 codee3
Number of contacts25
Base Number Matches1
INTERCONNECTS
SERIES 304, 346 • .100” GRID SOLDERLESS PRESS
-
FIT •
SINGLE ROW STRIPS
Unique compliant tail pins conform to the
plated through-hole without stressing the
inner layers of a multilayer board
series: .036”-.041” use a 1,1mm drill prior to
plating. Using MM #0477 & #0478 pins. See
page 162 for details
.015-.025
.010 .018
Recommended plated through-hole for 304
.175
.102
.110
.150
.044 DIA.
.025 DIA.
.026
.072
.175
For 346 series: .040”+.003” nished plated
through-hole. Using MM #4612 & #4613 pins.
See page 162 for details. Patent No. 4,799,904
Hi-Rel, 4- nger BeCu #30 contact is rated at
3 amps. See page 253 for details
FIG. 1
.015-.025
.010 .018
Insulators are high temperature thermoplastic
ORDERING INFORMATION
Series 304...770
.175
.102
.110
.150
Solderless Press-Fit
For .062” Thick Boards
.044 DIA.
.025 DIA.
.026
.072
.250
FIG. 1
Series 304...780
304 XX 1_ _ 41 770000
Specify number of pins
01-64
Solderless Press-Fit
For .125” Thick Boards
FIG. 2
.015-.025
.010 * .018
.101
.110
.195
FIG. 2
304 XX 1_ _ 41 780000
Specify number of pins
01-64
.150
Mill-Max recommends plating Code 13 for Series 304...770 and 304...780
.173
Series 346...012
Compliant Solderless Press-Fit
346 XX 1_ _ 41 012000
.045 DIA.
.120
.035 DIA.
.018
SLOT
FIG. 3
For .060”-.100” Thick Boards
Specify number of pins
01-64
FIG. 3
.015-.025
.010 * .018
.101
.110
.195
Series 346...013
Compliant Solderless Press-Fit
PAGE 73 | INTERCONNECTS
346 XX 1_ _ 41 013000
FIG. 4
.173
For .090”-.130” Thick Boards
.150
Specify number of pins
RoHS - 2
01-64
For
Electrical, Mechanical
& Enviromental Data,
See page 264
.045 DIA.
.175
2011/65/EU
.035 DIA.
.018
SLOT
XX=Plating Code
See Below
11
10
µ”
Au
10
µ”
Au
SPECIFY PLATING CODE XX=
13
30
µ”
Au
91
10
µ”
Au
93
99
41
43
44
FIG. 4
Sleeve (Pin)
Contact (Clip)
10
µ”
Au
200
µ”
Sn/Pb 200
µ”
Sn/Pb 200
µ”
Sn/Pb
200
µ”
Sn 200
µ”
Sn 200
µ”
Sn
30
µ”
Au
100
µ”
Sn/Pb
10
µ”
Au
30
µ”
Au 100
µ”
Sn
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
Simulation Design Method for RF Low Noise Amplifier
This paper discusses the method of designing the low noise amplifier (LNA) at the receiving end of the radio frequency integrated circuit (RFIC) using the HP microwave circuit simulation software EESO...
JasonYoo Analog electronics
【McQueen Trial】 Main components of McQueen
Because DFRobot did not provide much information about McQueen, I simply analyzed the main components. The front and back of McQueen [img]http://wiki.dfrobot.com.cn/images/3/3b/%E9%BA%A6%E6%98%863.0%E...
dcexpert MicroPython Open Source section
The semiconductor industry can support future development
Semiconductor industry can support future development. Compared with 2009, the situation of the global semiconductor industry is much better this year, but there are still a few people who question wh...
decho0821 Medical Electronics
How to use the Ethernet of STM32F2XX. If anyone has the Chinese version of the information, please post it and share it.
Frame check sequence: 4-byte field that contains the cyclic redundancy check (CRC)value. The CRC computation is based on the following fields: source address, destination address, QTag prefix, length/...
tinaliang stm32/stm8
The inner structure of new LED bulbs (Part 2): The heat sink connection structure is different
The hemispherical part that diffuses the LED light is called the "globe". Toshiba Lighting's globe is made of polycarbonate and is fixed to four locations above the heat sink with adhesive. The globe ...
zhuxl Power technology
The 2nd "Freescale" Cup National College Student Intelligent Vehicle Invitational Competition - Technical Report of Shanghai Jiaotong University Team
[i=s] This post was last edited by paulhyde on 2014-9-15 09:07 [/i] The 2nd "Freescale" Cup National College Student Intelligent Car Invitational Competition - Shanghai Jiaotong University Team Techni...
r54284 Electronics Design Contest

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 599  1123  2145  1270  2650  13  23  44  26  54 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号