Storage Temperature Range .............................-65°C to +150°C
Junction Temperature .....................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
*Dissipation
wattage values are based on still air with no heat sink. Actual maximum power dissipation is a function of heat extraction
technique and may be substantially higher.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= +9.75V, V
EE
= -4.75V, V
GS
= 0, V
T
12 = V
T
34 = 1.8V, T
J
= +85°C, unless otherwise noted. All temperature coefficients are measured
at T
J
= +60°C to +100°C, unless otherwise noted.) (Note 1)
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Microchip MCU
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