LOW PROFILE SURFACE MOUNT
10BASE-T INTERFACE MODULES
Ideal for Type I or Type II PCMCIA Applications
Th
Set
in
TM
Designed to exceed IEEE802.3i-1993
Improved performance for FCC and CISPR
Class B certification
235°C°peak IR Reflow temperature Rating
Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C
Part
Number
PE-68032
PE-68034
PE-68035
PE-68036
Insertion Loss*
(dB MAX)
1-10 MHz
-1.2
-5.0
-5.0
-5.0
30 MHz
-35
-35
-35
-30
Attenuation
(XMT) (dB MIN)
50 MHz
-35
-35
-35
-30
100 MHz
-40
-40
-40
-40
Return Loss
(dB MIN)
5-10 MHz
-18
-18
-18
-18
Crosstalk
(dB MIN)
5-10 MHz
-50
-50
-50
-50
10 MHz
-60
-55
-55
-55
Commom Mode Rejection
(XMT) (dB MIN)
50 MHz
-40
-40
-45
-40
100 MHz
-35
-35
-35
-35
200 MHz
-30
-30
-30
-30
Hipot
(V
RMS
MIN)
2000
2000
2000
2000
*Test includes pre-distortion resistors, which reflect additional attenuation.
.100
2,54
.010 X .020
0,25 X 0,51
.600
15,24
14 X
.030
0,76
PE-XXXXX
(DATE CODE)
.525
13,34
.565 .705
14,35 17,91
Dimensions:
Inches
mm
Unless otherwise specified,
all tolerances are ± .010
0,25
.100
2,54
.800
MAX
20,3
.094
MAX
2,39
Suggested Pad Layout
.675
17,15
0°-8°
.035
0,89
Weight
. . . . . . . . . .1.5 grams
Tape & Reel
. . . . . . .600/reel
Tube
. . . . . . . . . . . . . .25/tube
USA 858 674 8100
•
Germany 49 7032 7806 0
•
Singapore 65 6287 8998
•
Shanghai 86 21 54643211/2
•
China 86 755 33966678
•
Taiwan 886 3 4641811
ww.pulseeng.com
1
E103.B (9/07)
LOW PROFILE SURFACE MOUNT
10BASE-T INTERFACE MODULES
Ideal for Type I or Type II PCMCIA Applications
Application
Pulse’s ThinSet 10Base-T modules are the optimum analog solution for PCMCIA applications. Primary design features include electrical
functions, mechanical packaging and process standards.
TM
Electrical Functions
• Impedance Matching • Equipment Isolation • EMI suppression
Each module contains low pass filters, isolation transformers, and
common mode chokes. Most also include pre-emphasis and
impedance matching resistors. Please refer to the appropriate
application circuit and resistor chart for specific configurations.
Process Standards
• SMT requirements • Quality Assurance • Construction Methods
Materials, resistant to high temperatures, have been selected for
thermal compatibility to comply with industry standard reflow
methods. Post dipping the leads helps ensure solderability to the PC
board. Improved construction techniques increase package reliability
in high stress environments.
Mechanical Packaging
• Dimensions • External Features • Internal Construction
The low .094" profile allows for use in both Type I and Type II
applications. ThinSet
TM
modules are highly integrated to keep a
compact form factor for improved thermal management. Compliant
leads provide excellent solder-joint reliability with ±.002" coplanarity.
Advanced mechanical design yields more consistent and repeatable
electrical performance.
Note:
Modules are packaged in tubes unless tape and reel is specified.
Please add the suffix “T” (i.e. PE-68032T) for tape and reel orders,
increments of 600 pieces.
For More Information:
Pulse Worldwide
Headquarters
12220 World Trade Dr.
San Diego, CA 92128
U.S.A.
www.pulseeng.com
Pulse European
Headquarters
Einsteinstrasse 1
71083 Herrenberg
Germany
Pulse China
Headquarters
B402, Shenzhen
Tech-Innovation International
10th Kejinan Rd.
High-Tech Industrial Park
Nanshan District, Shenzen
China
TEL: 86 755 33966678
FAX: 86 755 33966700
Pulse North China
Room 1503
XinYin Building
No. 888 YiShan Road
Shanghai 200233
China
Pulse South Asia
150 Kampong Ampat
#07-01/02
KA Centre
Singapore 368324
Pulse North Asia
No. 26
Kao Ching Road
Yang Mei Chen
Taoyuan Hsien
Taiwan, R. O. C.
TEL: 858 674 8100
FAX: 858 674 8262
TEL: 49 7032 7806 0
FAX: 49 7032 7806 12
TEL: 86 21 54643211/2
FAX: 86 21 54643210
TEL: 65 6287 8998
FAX: 65 6280 0080
TEL: 886 3 4641811
FAX: 886 3 4641911
Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product names
mentioned herein may be trademarks or registered trademarks of their respective owners.
© Copyright, 2007. Pulse Engineering, Inc. All rights reserved.
ww.pulseeng.com
4
E103.B (9/07)
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