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MPC8567VTAUJJ

Description
Microprocessors - MPU Non-Encrypt No PB 1.3GHz
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,139 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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MPC8567VTAUJJ Overview

Microprocessors - MPU Non-Encrypt No PB 1.3GHz

MPC8567VTAUJJ Parametric

Parameter NameAttribute value
Brand NameFreescale
Is it lead-free?Contains lead
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeBGA
package instruction33 X 33 MM, 2.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCPBGA-1023
Contacts1023
Reach Compliance Codenot_compliant
ECCN code5A992
Address bus width
bit size32
boundary scanYES
maximum clock frequency166 MHz
External data bus width
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B1023
JESD-609 codee2
length33 mm
low power modeYES
Humidity sensitivity level3
Number of terminals1023
Maximum operating temperature105 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA1023,32X32,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1.1,1.8/2.5,2.5/3.3 V
Certification statusNot Qualified
Maximum seat height2.75 mm
speed1333 MHz
Maximum supply voltage1.155 V
Minimum supply voltage1.045 V
Nominal supply voltage1.1 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTIN COPPER/TIN SILVER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width33 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Freescale Semiconductor
Technical Data
Document Number: MPC8568EEC
Rev. 1, 10/2010
MPC8568E/MPC8567E
PowerQUICC III
Integrated Processor
Hardware Specifications
Due to feature similarities, this document covers both the
MPC8568E and MPC8567E features. For simplicity,
MPC8568 may only be mentioned throughout the document.
The MPC8567E feature differences are as follows:
• The MPC8567E PCI-Express supports x1/x2/x4, but
does not have x8 support.
• Does not have eTSEC1, eTSEC2, or TLU
Note that both the MPC8568E and MPC8567E have their
own pin assignment tables.
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Contents
MPC8568E Overview . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 10
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14
Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 18
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 18
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Ethernet Interface and MII Management . . . . . . . . . . 26
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . . 61
PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Serial RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
PIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
UTOPIA/POS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
HDLC, BISYNC, Transparent and
Synchronous UART . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Package and Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
System Design Information . . . . . . . . . . . . . . . . . . . 130
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 136
Document Revision History . . . . . . . . . . . . . . . . . . 138
© 2010 Freescale Semiconductor, Inc. All rights reserved.

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Description Microprocessors - MPU Non-Encrypt No PB 1.3GHz Microprocessors - MPU 8568 1.33GHz Non Encrypt Microprocessors - MPU 800MHz Non-Encrypt Microprocessors - MPU No PB 1.3 GHz Microprocessors - MPU 8568 1GHz Pb Free Microprocessors - MPU 1GHz Non-Encrypt
Brand Name Freescale Freescale Freescale - Freescale -
Is it lead-free? Contains lead Contains lead Contains lead - Contains lead Contains lead
Is it Rohs certified? conform to conform to conform to - conform to conform to
Maker NXP NXP NXP - NXP NXP
Parts packaging code BGA BGA BGA - BGA BGA
package instruction 33 X 33 MM, 2.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCPBGA-1023 BGA, BGA1023,32X32,40 BGA, BGA1023,32X32,40 - BGA, BGA1023,32X32,40 BGA, BGA1023,32X32,40
Contacts 1023 1023 1023 - 1023 1023
Reach Compliance Code not_compliant not_compliant not_compliant - not_compliant not_compliant
ECCN code 5A992 5A992 5A992 - 5A002.A 5A992
Address bus width - 16 16 - 16 16
bit size 32 32 32 - 32 32
boundary scan YES YES YES - YES YES
External data bus width - 64 64 - 64 64
Format FLOATING POINT FIXED POINT FIXED POINT - FIXED POINT FIXED POINT
Integrated cache YES YES YES - YES YES
JESD-30 code S-PBGA-B1023 S-PBGA-B1023 S-PBGA-B1023 - S-PBGA-B1023 S-PBGA-B1023
JESD-609 code e2 e2 e2 - e2 e2
length 33 mm 33 mm 33 mm - 33 mm 33 mm
low power mode YES YES YES - YES YES
Humidity sensitivity level 3 3 3 - 3 3
Number of terminals 1023 1023 1023 - 1023 1023
Maximum operating temperature 105 °C 105 °C 105 °C - 105 °C 105 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA - BGA BGA
Encapsulate equivalent code BGA1023,32X32,40 BGA1023,32X32,40 BGA1023,32X32,40 - BGA1023,32X32,40 BGA1023,32X32,40
Package shape SQUARE SQUARE SQUARE - SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 260 - 260 260
power supply 1.1,1.8/2.5,2.5/3.3 V 1.1,1.8/2.5,2.5/3.3 V 1.1,1.8/2.5,2.5/3.3 V - 1.1,1.8/2.5,2.5/3.3 V 1.1,1.8/2.5,2.5/3.3 V
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 2.75 mm 2.75 mm 2.75 mm - 2.75 mm 2.75 mm
speed 1333 MHz 1333 MHz 800 MHz - 1000 MHz 1000 MHz
Maximum supply voltage 1.155 V 1.155 V 1.155 V - 1.155 V 1.155 V
Minimum supply voltage 1.045 V 1.045 V 1.045 V - 1.045 V 1.045 V
Nominal supply voltage 1.1 V 1.1 V 1.1 V - 1.1 V 1.1 V
surface mount YES YES YES - YES YES
technology CMOS CMOS CMOS - CMOS CMOS
Temperature level OTHER OTHER OTHER - INDUSTRIAL OTHER
Terminal surface TIN COPPER/TIN SILVER TIN COPPER/TIN SILVER TIN COPPER/TIN SILVER - TIN COPPER/TIN SILVER TIN COPPER/TIN SILVER
Terminal form BALL BALL BALL - BALL BALL
Terminal pitch 1 mm 1 mm 1 mm - 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 40 40 - 40 40
width 33 mm 33 mm 33 mm - 33 mm 33 mm
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