SerieS overview
*QfP (Quad flat PaCkageS, gullwing leadS)
0.65mm PitCh
SerieS iC51 (ClamShell - th) QfP, PQfP, tQfP and mQuad®
*QFP variations e.g. BQFP...
SPeCifiCationS
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
1,000MΩ min. at 100V DC
for 1 minute (socket depended)
30mΩ max. at 10mA/20mV max.
–40°C to +150°C (for type PEI/PSF)
–55°C to +170°C (for type PES)
–55°C to +170°C (for type PEI)
10,000 insertions min.
Part number
iC51 - 048 4 - 652
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
Mating Cycles:
materialS and finiSh
Housing:
Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass-filled
Polyetherimide (PEI), glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
Contacts:
Plating:
As specifications for this product differ
by pitch and material-mix, please contact
Yamaichi for detailed information.
SerieS iC357 (oPen toP - th)
Quad flat PaCkage (QfP) with 2-Point ContaCt tyPe
SPeCifiCationS
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Contact Force:
1,000MΩ min. at 500V DC, pitch 0.4 to 0.8
100V AC for 1 minute, pitch 0.5 to 0.8
30mΩ max. at 10mA/20mV max.
–40°C to +150°C
10,000 insertions min.
20g to 45g per pin
Part number
iC357 - 100
Series No.
No. of Contact Pins
Number of Sides with Contacts
4 - 002 - *
materialS and finiSh
Housing:
Contacts:
Plating:
Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
INFO:
Various types with movable GND pin options available
SerieS iC234 (oPen toP - th)
Quad flat PaCkage (QfP) with Shoulder ContaCt tyPe
SPeCifiCationS
Insulation Resistance:
Dielectric Withstanding Voltage:
1,000MΩ min. at 100V DC pitch 0.4, 0.5
1,000MΩ min. at 500V DC pitch 0.65, 0.8
100V AC for 1 minute pitch 0.4, 0.5
500V AC for 1 minute pitch 0.65
700V AC for 1 minute pitch 0.8
30mΩ max. at 10mA/20mV max.
–40°C to +150°C
20g to 80g per pin
10,000 insertions min.
Part number
iC234 - 120 4 - 058 - *
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
K = Protection Key**
** Protection Key: Prevents IC from releasing during transportation
Contact Resistance:
Operating Temperature Range:
Contact Force:
Mating Cycles:
materialS and finiSh
Housing:
Contacts:
Plating:
Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
12
SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
ContaCting - SemiConduCtor
SerieS overview
*QfP (Quad flat PaCkageS, gullwing leadS)
0.65mm PitCh
SerieS iC201 (oPen toP - th) - Quad flat PaCkageS (QfP)
SPeCifiCationS
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Contact Force:
Mating Cycles:
1,000MΩ min. at 500V DC or
1,000MΩ min. at 100V DC
100/500/700V AC for 1 minute
30mΩ max. at 10mA/20mV max.
–40°C to +170°C and –40°C to +150°C
20g to 80g per pin
10,000 insertions min.
Part number
iC201 - 080 4 - 012 * - *
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
Protection Key**
K = With Protection Key
Unmarked = Without Protectin Key
** Protection Key: Prevents IC from releasing during transportation
The information above is typical for this Series
for individual specifications please contact Yamaichi
Materials and Finish
Housing:
Contacts:
Plating:
Polyetherimide (PEI), glass-filled
Polyphenylenesulfide (PPS), glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
SerieS iC500 (oPen toP - th)
Quad flat PaCkage (QfP) with 2-Point ContaCt tyPe
SPeCifiCationS
Insulation Resistance:
Dielectric Withstanding Voltage:
1,000MΩ min. at 100V DC pitch 0.5
1,000MΩ min. at 500V DC pitch 0.65, 0.8
100V AC for 1 minute pitch 0.5
500V AC for 1 minute pitch 0.65
700V AC for 1 minute pitch 0.8
30mΩ max. at 10mA/20mV max.
–40°C to +150°C
20g to 80g per pin
10,000 insertions min.
Part number
iC500 - 064 4 - 008 - *
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
K = Protection Key**
** Protection Key: Prevents IC from releasing during transportation
Contact Resistance:
Operating Temperature Range:
Contact Force:
Mating Cycles:
materialS and finiSh
Housing:
Contacts:
Plating:
Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
INFO:
Various types with movable GND pin options available
ContaCt StyleS
SerieS iC51
SerieS iC357 / iC402
SerieS iC234
SerieS iC (kelvin)
SerieS iC2**
SerieS iC500
SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
ContaCting - SemiConduCtor
13
NXP MCU
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