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73K302L-IP

Description
Single-Chip Modem
CategoryWireless rf/communication    Telecom circuit   
File Size285KB,29 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
Download Datasheet Parametric Compare View All

73K302L-IP Overview

Single-Chip Modem

73K302L-IP Parametric

Parameter NameAttribute value
MakerTDK Corporation
Parts packaging codeDIP
package instructionDIP,
Contacts28
Reach Compliance Codeunknow
Other featuresFULL DUPLEX
data rate1.2 Mbps
JESD-30 codeR-PDIP-T28
length35.941 mm
Number of functions1
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum seat height5.588 mm
Maximum slew rate12 mA
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
73K302L
Bell 212A, 103, 202
Single-Chip Modem
April 2000
DESCRIPTION
The 73K302L is a highly integrated single-chip
modem IC which provides the functions needed to
construct a Bell 202, 212A and 103 compatible
modem. The 73K302L is an enhancement of the
73K212L single-chip modem with Bell 202 mode
features added. The 73K302L is capable of 1200 or
0-300 bit/s full-duplex operation over dial-up lines.
4-wire full-duplex capability and a low speed back
channel are also provided in Bell 202 mode. The
73K302L recognizes and generates a 900 Hz soft
carrier turn-off tone, and allows 103 for 300 bit/s
FSK operation. The 73K302L integrates analog,
digital, and switched-capacitor array functions on a
single substrate, offering excellent performance and
a high level of functional integration in a single
28-pin DIP or PLCC package. The 73K302L
operates from a single +5V supply with very low
power consumption.
The 73K302L includes the DPSK and FSK
modulator/demodulator functions, call progress and
handshake tone monitors, test modes, and a tone
generator capable of producing DTMF, answer, and
900 Hz soft carrier turn-off tone. This device
supports Bell 202, 212A and 103 modes of
operation, allowing both synchronous and
(continued)
FEATURES
One-chip Bell 212A, 103 and 202S/T standard
compatible modem data pump
Full-duplex operation at 0-300 bit/s (FSK), 1200 bit/s
(DPSK) or 0-1200 bit/s (FSK) forward channel with or
without 0-150 bit/s back channel
Full-duplex 4-wire operation in Bell 202 mode
Pin and software compatible with other TDK
Semiconductor
Corporation
K-Series
1-chip
modems
Interfaces directly with standard microprocessors
(8048, 80C51 typical)
Serial port for data transfer
Both synchronous and asynchronous modes of
operation
Call progress, carrier, precise answer tone
(2225 Hz), soft carrier turn-off (SCT), and FSK mark
detectors
DTMF, answer, and SCT tone generators
Test modes available: ALB, DL, RDL, Mark, Space,
Alternating bit patterns
CMOS technology for low power consumption using
60 mW @ 5V from a single power supply
BLOCK DIAGRAM
AD0-AD7
DATA
BUS
BUFFER
8-BIT
BUS
FOR
RD
WR
ALE
CS
RESET
READ
WRITE
CONTROL
LOGIC
CONTROL
AND
STATUS
DIGITAL
PROCESSING
PSK
MODULATOR/
DEMODULATOR
FSK
MODULATOR/
DEMODULATOR
DTMF &
TONE
GENERATORS
TRANSMIT
FILTER
RECEIVE
FILTER
TXA
RXA
INT
STATUS
AND
CONTROL
LOGIC
TXD
RXD
SERIAL
PORT
FOR
DATA
TESTS:
ALB, DLB
RDLB
PATTERNS
CLOCK
GENERATOR
SMART
DIALING
&
DETECT
FUNCTIONS
POWER
RXCLK
EXCLK
TXCLK
CLK
XTL1
XTL2
GND
VREF
VDD
ISET

73K302L-IP Related Products

73K302L-IP 73K302L-IH
Description Single-Chip Modem Single-Chip Modem
Maker TDK Corporation TDK Corporation
Parts packaging code DIP QLCC
package instruction DIP, QCCJ,
Contacts 28 28
Reach Compliance Code unknow unknow
Other features FULL DUPLEX FULL DUPLEX
data rate 1.2 Mbps 1.2 Mbps
JESD-30 code R-PDIP-T28 S-PQCC-J28
length 35.941 mm 11.5062 mm
Number of functions 1 1
Number of terminals 28 28
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP QCCJ
Package shape RECTANGULAR SQUARE
Package form IN-LINE CHIP CARRIER
Certification status Not Qualified Not Qualified
Maximum seat height 5.588 mm 4.572 mm
Maximum slew rate 12 mA 12 mA
Nominal supply voltage 5 V 5 V
surface mount NO YES
technology CMOS CMOS
Telecom integrated circuit types MODEM MODEM
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE J BEND
Terminal pitch 2.54 mm 1.27 mm
Terminal location DUAL QUAD
width 15.24 mm 11.5062 mm

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