BGA Heat Sink - High Performance
Device Specific - NXP
ATS Part#:
Description:
ATS-59005-C1-R0
29.00 x 37.00 x 10.00 mm BGA Heat Sink - High Performance Device Specific - NXP
Heat Sink Type:
Heat Sink Attachment:
Equivalent Part Number:
NXP
maxiGRIP
ATS-59005-C2-R0
Discontinued
*Image above is for illustration purpose only.
Features & Benefits
Designed for flip-chip processors such as NXP MPCs
maxiGRIP™
attachment applies steady, even pressure to the component and does not require holes in the PCB
Comes preassembled with high performance, phase changing, thermal interface material
Thermal Performance
AIR VELOCITY
@200 LFM
1.0 M/S
Unducted Flow
THERMAL RESISTANCE
Ducted Flow
3.8
N/A
N/A
N/A
N/A
N/A
N/A
6.2 °C/W
@300 LFM
1.5 M/S
4.95 °C/W
@400 LFM
2.0 M/S
4.2 °C/W
@500 LFM
2.5 M/S
3.7 °C/W
@600 LFM
3.0 M/S
3.3 °C/W
@700 LFM
3.5 M/S
3 °C/W
@800 LFM
4.0 M/S
2.8 °C/W
Product Detail
Schematic Image
Dimension A
29.00 mm
Dimension B
37.00 mm
Dimension C
10.00 mm
Dimension D
54 mm
TIM
T766
Finish
BLACK-ANODIZED
Notes:
Dimension
A
and
B
refer to component size.
Dimension
C
is the heat sink height from the bottom of the base to the top of the fin field.
ATS-59005-C2-R0 is the exact heat sink assembly with an equivalent thermal interface material
(Saint Gobain C1100F). NOTE: Saint Gobain C1100F is discontinued effective 12/31/10.
Thermal performance data are provided for reference only. Actual performance may vary by
application.
ATS reserves the right to update or change its products without notice to improve the design or
performance.
ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.
Optional
maxiGRIP™
Installation/Removal Tool Set P/N:
MGT170
Contact ATS to learn about custom options available.
*Image above is for illustration purpose only.
For more information, to find a distributor or to place an order, please contact us at
781-769-2800 (North America),
sales@qats.com
or
www.qats.com.
© 2013 Advanced Thermal Solutions, Inc.
| 89-27 Access Road | Norwood MA | 02062 | USA
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