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364424B00032G

Description
Heat Sinks 40.1X40X11.4mm ADHSV
CategoryThermal management products    Heat resisting bracing   
File Size197KB,1 Pages
ManufacturerAavid Thermalloy
Environmental Compliance
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364424B00032G Overview

Heat Sinks 40.1X40X11.4mm ADHSV

364424B00032G Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
Main materialALUMINUM
colorBLACK
structureFIN
fin directionOMNIDIRECT
Surface layerANODIZED
high11.4 mm
length40 mm
contourPIN FIN ARRAY
Heat Resistant Support Device TypeHEAT SINK
width40.1 mm
Base Number Matches1

364424B00032G Preview

DATASHEET 
 
 
Board Level Cooling – 3644 
 
 
 
 
 
 
BOARD LEVEL COOLING ‐ 3644 
3644 is a series of square pin fin board level heat sinks designed to cool BGA 
and FPGA devices. These heat sinks use pressure sensitive adhesive for 
mounting. Representative image only. 
ORDERING INFORMATION
 
Part Number 
364424B00032G 
364424B00034G 
 
Device Type 
BGA, FPGA 
BGA, FPGA 
 
 
  
 
HEAT SINK DETAILS 
Property 
 Material 
Finish 
Device Attachment Options 
Thermal Interface Material 
364424B00032G 
Thermal Interface Material 
364424B00034G 
 
Details 
Aluminum 
Black Anodize 
Tape 
T405R Chomerics Tape for  
Metal Surfaces  
T410R Chomerics Tape for Plastic 
Surfaces 
Property 
Heat Sink Width (mm) 
Heat Sink Length (mm) 
Heat Sink Height (mm) 
Heat Sink Mounting Direction 
Details 
40.13 
40.00 
11.43 
Horizontal, Vertical 
 
 
 
MECHANICAL & PERFORMANCE  
Drawing dimensions are shown in mm, (in) 
 
 
 
 
 
 
 
 
 
 
USA: 1.855.322.2843 
EUROPE: 39.051.764002 
ASIA: 86.21.6115.2000 x8122 
 
 
 
 
 
 
 
 
 
 
    Board Level Cooling 
    www.aavid.com 
 
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