Intel® Xeon® Processor E5-1600/
E5-2600/E5-4600 Product Families
Datasheet - Volume One
May 2012
Reference Number: 326508, Revision: 002
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The Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families, Intel® C600 series chipset, and the Intel® Xeon®
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Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families
Datasheet Volume One
Contents
1
Overview
................................................................................................................. 13
1.1
Introduction ..................................................................................................... 13
1.1.1 Processor Feature Details ........................................................................ 14
1.1.2 Supported Technologies .......................................................................... 14
1.2
Interfaces ........................................................................................................ 15
1.2.1 System Memory Support ......................................................................... 15
1.2.2 PCI Express* ......................................................................................... 16
1.2.3 Direct Media Interface Gen 2 (DMI2)......................................................... 17
1.2.4 Intel® QuickPath Interconnect (Intel® QPI) .............................................. 18
1.2.5 Platform Environment Control Interface (PECI) ........................................... 18
1.3
Power Management Support ............................................................................... 19
1.3.1 Processor Package and Core States........................................................... 19
1.3.2 System States Support ........................................................................... 19
1.3.3 Memory Controller.................................................................................. 19
1.3.4 PCI Express ........................................................................................... 19
1.3.5 Intel QPI ............................................................................................... 19
1.4
Thermal Management Support ............................................................................ 19
1.5
Package Summary............................................................................................. 20
1.6
Terminology ..................................................................................................... 20
1.7
Related Documents ........................................................................................... 22
1.8
State of Data .................................................................................................... 23
Interfaces................................................................................................................
25
2.1
System Memory Interface .................................................................................. 25
2.1.1 System Memory Technology Support ........................................................ 25
2.1.2 System Memory Timing Support............................................................... 25
2.2
PCI Express* Interface....................................................................................... 26
2.2.1 PCI Express* Architecture ....................................................................... 26
2.2.2 PCI Express* Configuration Mechanism ..................................................... 27
2.3
DMI2/PCI Express* Interface .............................................................................. 28
2.3.1 DMI2 Error Flow ..................................................................................... 28
2.3.2 Processor/PCH Compatibility Assumptions.................................................. 28
2.3.3 DMI2 Link Down..................................................................................... 28
2.4
Intel QuickPath Interconnect............................................................................... 28
2.5
Platform Environment Control Interface (PECI) ...................................................... 30
2.5.1 PECI Client Capabilities ........................................................................... 30
2.5.2 Client Command Suite ............................................................................ 31
2.5.3 Client Management................................................................................. 69
2.5.4 Multi-Domain Commands ........................................................................ 74
2.5.5 Client Responses .................................................................................... 75
2.5.6 Originator Responses .............................................................................. 76
2.5.7 DTS Temperature Data ........................................................................... 76
Technologies
........................................................................................................... 79
3.1
Intel® Virtualization Technology (Intel® VT) ........................................................ 79
3.1.1 Intel VT-x Objectives .............................................................................. 79
3.1.2 Intel VT-x Features................................................................................. 80
3.1.3 Intel VT-d Objectives .............................................................................. 80
3.1.4 Intel Virtualization Technology Processor Extensions ................................... 81
3.2
Security Technologies ........................................................................................ 81
3.2.1 Intel® Trusted Execution Technology........................................................ 81
3.2.2 Intel Trusted Execution Technology – Server Extensions .............................. 82
3.2.3 Intel® Advanced Encryption Standard Instructions (Intel® AES-NI).............. 82
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Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families
Datasheet Volume One
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3.3
3.4
3.5
3.6
3.7
3.8
4
3.2.4 Execute Disable Bit .................................................................................83
Intel® Hyper-Threading Technology .....................................................................83
Intel® Turbo Boost Technology ...........................................................................83
3.4.1 Intel® Turbo Boost Operating Frequency ...................................................83
Enhanced Intel SpeedStep® Technology ...............................................................84
Intel® Intelligent Power Technology.....................................................................84
Intel® Advanced Vector Extensions (Intel® AVX) ..................................................84
Intel Dynamic Power Technology .........................................................................85
Power Management
.................................................................................................87
4.1
ACPI States Supported .......................................................................................87
4.1.1 System States........................................................................................87
4.1.2 Processor Package and Core States ...........................................................87
4.1.3 Integrated Memory Controller States .........................................................88
4.1.4 DMI2/PCI Express* Link States.................................................................89
4.1.5 Intel QuickPath Interconnect States ..........................................................89
4.1.6 G, S, and C State Combinations................................................................90
4.2
Processor Core/Package Power Management .........................................................90
4.2.1 Enhanced Intel SpeedStep Technology.......................................................90
4.2.2 Low-Power Idle States.............................................................................91
4.2.3 Requesting Low-Power Idle States ............................................................92
4.2.4 Core C-states .........................................................................................92
4.2.5 Package C-States ...................................................................................94
4.2.6 Package C-State Power Specifications........................................................97
4.3
System Memory Power Management ....................................................................98
4.3.1 CKE Power-Down ....................................................................................98
4.3.2 Self Refresh ...........................................................................................98
4.3.3 DRAM I/O Power Management ..................................................................99
4.4
DMI2/PCI Express* Power Management ................................................................99
Thermal Management Specifications
...................................................................... 101
5.1
Package Thermal Specifications ......................................................................... 101
5.1.1 Thermal Specifications........................................................................... 101
5.1.2 TCASE and DTS Based Thermal Specifications........................................... 103
5.1.3 Processor Thermal Profiles ..................................................................... 104
5.1.4 Embedded Server Processor Thermal Profiles............................................ 130
5.1.5 Thermal Metrology ................................................................................ 133
5.2
Processor Core Thermal Features ....................................................................... 135
5.2.1 Processor Temperature.......................................................................... 135
5.2.2 Adaptive Thermal Monitor ...................................................................... 135
5.2.3 On-Demand Mode ................................................................................. 137
5.2.4 PROCHOT_N Signal ............................................................................... 137
5.2.5 THERMTRIP_N Signal ............................................................................ 138
5.2.6 Integrated Memory Controller (IMC) Thermal Features............................... 138
Signal Descriptions
................................................................................................ 141
6.1
System Memory Interface Signals ...................................................................... 141
6.2
PCI Express* Based Interface Signals ................................................................. 142
6.3
DMI2/PCI Express* Port 0 Signals ...................................................................... 144
6.4
Intel QuickPath Interconnect Signals .................................................................. 144
6.5
PECI Signal ..................................................................................................... 145
6.6
System Reference Clock Signals ........................................................................ 145
6.7
JTAG and TAP Signals....................................................................................... 145
6.8
Serial VID Interface (SVID) Signals .................................................................... 146
6.9
Processor Asynchronous Sideband and Miscellaneous Signals................................. 146
6.10 Processor Power and Ground Supplies ................................................................ 149
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Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families
Datasheet Volume One
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Electrical Specifications
......................................................................................... 151
7.1
Processor Signaling ......................................................................................... 151
7.1.1 System Memory Interface Signal Groups ................................................. 151
7.1.2 PCI Express* Signals ............................................................................ 151
7.1.3 DMI2/PCI Express* Signals.................................................................... 151
7.1.4 Intel QuickPath Interconnect (Intel QPI) .................................................. 151
7.1.5 Platform Environmental Control Interface (PECI) ...................................... 152
7.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)....................... 152
7.1.7 JTAG and Test Access Port (TAP) Signals ................................................. 153
7.1.8 Processor Sideband Signals ................................................................... 153
7.1.9 Power, Ground and Sense Signals........................................................... 153
7.1.10 Reserved or Unused Signals................................................................... 158
7.2
Signal Group Summary .................................................................................... 158
7.3
Power-On Configuration (POC) Options............................................................... 162
7.4
Fault Resilient Booting (FRB)............................................................................. 163
7.5
Mixing Processors............................................................................................ 163
7.6
Flexible Motherboard Guidelines (FMB) ............................................................... 164
7.7
Absolute Maximum and Minimum Ratings ........................................................... 164
7.7.1 Storage Conditions Specifications ........................................................... 165
7.8
DC Specifications ............................................................................................ 166
7.8.1 Voltage and Current Specifications.......................................................... 167
7.8.2 Die Voltage Validation ........................................................................... 173
7.8.3 Signal DC Specifications ........................................................................ 174
7.9
Waveforms..................................................................................................... 180
7.10 Signal Quality ................................................................................................. 181
7.10.1 DDR3 Signal Quality Specifications ......................................................... 182
7.10.2 I/O Signal Quality Specifications............................................................. 182
7.10.3 Intel QuickPath Interconnect Signal Quality Specifications.......................... 182
7.10.4 Input Reference Clock Signal Quality Specifications................................... 182
7.10.5 Overshoot/Undershoot Tolerance............................................................ 182
Processor Land Listing...........................................................................................
187
8.1
Listing by Land Name ...................................................................................... 187
8.2
Listing by Land Number ................................................................................... 212
Package Mechanical Specifications
........................................................................ 237
9.1
Package Mechanical Drawing............................................................................. 237
9.2
Processor Component Keep-Out Zones ............................................................... 241
9.3
Package Loading Specifications ......................................................................... 241
9.4
Package Handling Guidelines............................................................................. 241
9.5
Package Insertion Specifications........................................................................ 241
9.6
Processor Mass Specification ............................................................................. 242
9.7
Processor Materials.......................................................................................... 242
9.8
Processor Markings.......................................................................................... 242
Boxed Processor Specifications
............................................................................. 243
10.1 Introduction ................................................................................................... 243
10.1.1 Available Boxed Thermal Solution Configurations ...................................... 243
10.1.2 Intel Thermal Solution STS200C
(Passive/Active Combination Heat Sink Solution) ...................................... 243
10.1.3 Intel Thermal Solution STS200P and STS200PNRW
(Boxed 25.5 mm Tall Passive Heat Sink Solutions).................................... 244
10.2 Mechanical Specifications ................................................................................. 245
10.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones ........ 245
10.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS) ...... 254
10.3 Fan Power Supply [STS200C]............................................................................ 254
10.3.1 Boxed Processor Cooling Requirements ................................................... 255
10.4 Boxed Processor Contents ................................................................................ 257
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Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families
Datasheet Volume One
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